2004
DOI: 10.1109/jssc.2004.829936
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A dual-band 5.15-5.35-GHz, 2.4-2.5-GHz 0.18-/spl mu/m CMOS transceiver for 802.11a/b/g wireless LAN

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Cited by 55 publications
(23 citation statements)
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“…10, which is above 28 dBc at the ±1.2-MHz offset frequency. Due to the low in-band integrated phase noise and the digital calibration that eliminates I/Q mismatch and baseband filter mismatch, transmitter EVM is dominated by nonlinearities (Behzad Razzavi (1997), , K. Vavelidis et al (2004)). As shown in Fig.…”
Section: Lc-vcomentioning
confidence: 99%
“…10, which is above 28 dBc at the ±1.2-MHz offset frequency. Due to the low in-band integrated phase noise and the digital calibration that eliminates I/Q mismatch and baseband filter mismatch, transmitter EVM is dominated by nonlinearities (Behzad Razzavi (1997), , K. Vavelidis et al (2004)). As shown in Fig.…”
Section: Lc-vcomentioning
confidence: 99%
“…Devices of such type use baseband plus RF front-end to calibrate the gain and phase mismatch. For example, baseband signal processing techniques have been used to generate a test signal to the RF front-end [25,26,28]. Since the output of the RF front-end running this test signal will give information on the mismatch, the baseband can sense this output to determine a control code for the front-end circuits to compensate the mismatch.…”
Section: Introductionmentioning
confidence: 99%
“…The low-cost requirement is more imperative in WLAN than in any other standards, and numerous CMOS solutions have been reported [1][2][3][4][5][6][7][8][9][10]. For low-cost CMOS integration, direct conversion to dc or low IF is common, but problems such as dc offset, I/Q mismatch, self-mixing, power amplifier pull, flicker noise, ect., limit their widespread applications.…”
Section: Introductionmentioning
confidence: 99%
“…The RF impedance matching is a difficult task since the matching impedance is usually 50 . In the literatures, many RF front-ends implemented the impedance matching off-chip [1,2] or bondwire inductance [3,5,7,8], but extra off-chip components would increase the cost and lower the stability of the systems while the bondwire inductance couldn't be accurately controlled. So the on-chip impedance matching is highly expected for the low cost transceivers.…”
Section: Introductionmentioning
confidence: 99%