A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond

Abstract

A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross‐linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 °C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018, 56, 237–241

Photoadhesive Materials Containing 2-Mercaptopyridyl Moieties

“…In our group, use of this material as both dismantlable and reusable (rebonding) adhesive is undergoing, by utilizing chemical properties of disulfide bonds, i.e. bond-exchange reactions [6,26].…”

Debondable adhesives and their use in recycling

“…195 Disulfide bond exchange, is also commonly exploited for debonding, with adhesives based on a variety of networks including, epoxy resins and poly(benzoxazines). [196][197][198][199][200][201][202][203] These systems can be responsive to a wide range of stimuli, in addition to temperature, and may be debonded on demand utilising: light, heat, pH, nucleophiles or redox reagents, depending on the system.…”

Relief of Shrinkage of UV-cured Materials by Exchange Reactions of Disulfide Bonds

“…Previously, we have developed a thermal dismantlable photoadhesive having cross-linked epoxy networks containing disulfide bonds [19,20]. Adhesive strength for two stainless substrates was estimated to more than 1 MPa.…”