UV-cured films containing disulfide bonds were fabricated by radical UV curing with a diacrylate monomer. The free standing films were characterized by DSC, XPS, and Raman spectral measurements. Film shrinkage due to volume contraction during radical polymerization reactions was relieved by heating at 60 o C for 2 min, which was not observed in the control film sample containing no disulfide bonds. This quick relaxation would be due to relaxing the internal stress by exchange reactions between disulfide bonds.
Diacrylate having a dipyridyl disulfide moiety is synthesized as a cross-linker for photoadhesive materials. The cross-linker has been used with 2-hydroxylethyl acrylate and a photoradical initiator to adhere a glass substrate with various kinds of substrates such as glass, copper, polyvinyl chloride, and aluminum. After 4 J/cm 2 of UV irradiation at a wavelength of 365 nm, ca. 0.3-1.2 MPa of shear stress is recorded with the adhesive samples, which is superior to control adhesive samples having no dipyridyl disulfide moieties. From the results on XPS spectral measurements, it is indicated that both electron-rich sulfur atom and electron-poor nitrogen atom would contribute to the adhesion behavior.
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