A direct‐writing approach to the micro‐patterning of copper onto polyimide

Ng, Jack; Desmulliez, Marc Phillipe Yves; Lamponi, M.; Moffat, B.G.; McCarthy, Aongus; Suyal, H.; Walker, A. C.; Prior, K. A.; Hand, Duncan Paul

doi:10.1108/03056120910953268

Cited by 17 publications

(13 citation statements)

References 56 publications

(84 reference statements)

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“…Metals 2017, 7, 189 2 of 12 [6,13,[24][25][26][27][28]. Sputtering can produce a dense and uniform metallic layer with good adhesion on PI, but the high-vacuum operational environment makes cost-down difficult to achieve.…”

Section: Metallization Process Of Pimentioning

confidence: 99%

“…Recently, wearable and portable technologies have attracted considerable attention because multiple functions such as communication, internet, sensor, navigation, and media, can be integrated in a small and light-weight device [1][2][3][4][5][6][7][8][9]. The rapid development of wearable and portable devices has driven the microelectronic industries to develop new technologies to meet the demands of scale miniaturization and multi-functionality.…”

Section: Introductionmentioning

confidence: 99%

“…The flexible printed circuit board (FPCB) plays an important role in the development of wearable and portable devices due to its high flexibility in reducing packaging volume. Polyimide (PI) is a superior material as a substrate of FPCB and has many advantages such as light-weight, high thermal stability, and good anti-corrosion properties [1,3,6,[8][9][10][11][12][13][14][15][16][17][18][19]. PI also has a high potential in automotive applications [1] as it has a higher glass transition temperature (T g ) at 280-290 • C, which is more sustainable in a high-temperature operational environment.…”

Section: Introductionmentioning

confidence: 99%

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Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Lin

Chen

2017

Metals

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Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI.

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Section: Metallization Process Of Pimentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Lin

Chen

2017

Metals

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“…These methodologies are based on processes such as laser-based thermally induced deposition, laser-assisted surface modification for subsequent electroless deposition, and laser-assisted photocatalysis-mediated deposition, among others. [1,5] Some examples include the patterning of micron-sized platinum features using a continuous-wave (cw) argon ion laser (λ ¼ 514 nm) to induce the thermal decomposition of platinum metal-organic films coated onto quartz substrates for subsequent electroless plating. [6] In contrast, the selective activation of diamond substrates with a Cu vapor laser (λ ¼ 510 nm) and KrF excimer laser (λ ¼ 248 nm) was also reported.…”

Section: Introductionmentioning

confidence: 99%

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

et al. 2021

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The selective metallization of nonconductive polymer materials has broad applications in the fields of integrated circuit technology and metallized patterns. This work discusses a methodology to pattern metal tracks on polybutylene terephthalate substrates. The process consists of three steps: 1) surface patterning with picosecond laser pulses (1030 nm) in air, 2) Pd seeding via treatment in PdCl2 solution, and 3) selective metallization via electroless copper deposition. Picosecond laser irradiation promotes not only surface roughening but also chemical modification to enable Pd seeding as the polymer surface acquires the ability to reduce Pd(II)‐chloride species to metallic Pd. The laser parameters, as well as the PdCl2 concentration and seeding temperature, have an influence on the polymer surface morphology, the concentration and distribution of metallic Pd, and the copper layer properties. Homogeneous copper layers with well‐defined geometries, good coating‐substrate adhesion, and high electrical conductivity can be obtained. This is ascribed to the synergistic effect of the chemical surface activation and roughness development (from 0.13 to ≈1.6 μm). As the patterning and surface activation are performed in air, directly on the as‐received polymer substrate, this methodology shows great potential for metallization of electronic devices with 3D complex geometries.

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“…Micro moulding of a sol‐gel‐derived precursor resulted in the selective growth of the nanorods. Ng et al (2009) reported a direct laser writing approach to deposit micro‐patterned metal onto polymer. Here, a metal source is first doped into the substrate in the form of ions and a continuous wave HeCd laser was used for the reduction of metal ions allowing fine resolution of feature size.…”

Section: Introductionmentioning

confidence: 99%

Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

2010

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PurposeMaterial formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabrication of these advanced microelectronic devices. The purpose of this paper is to discuss the development of new laser‐processing capabilities involving the synthesis and optimization of materials for tunable device applications.Design/methodology/approachThe paper focuses on the application of laser processing to two specific material areas, namely thin films and nanocomposite films. The examples include BaTiO3‐based thin films and BaTiO3 polymer‐based nanocomposites.FindingsA variety of new regular and random 3D surface patterns are highlighted. A frequency‐tripled Nd:YAG laser operating at a wavelength of 355 nm is used for the micromachining study. The micromachining is used to make various patterned surface morphologies. Depending on the laser fluence used, one can form a “wavy,” random 3D structure, or an array of regular 3D patterns. Furthermore, the laser was used to generate free‐standing nano and micro particles from thin film surfaces. In the case of BaTiO3 polymer‐based nanocomposites, micromachining is used to generate arrays of variable‐thickness capacitors. The resultant thickness of the capacitors depends on the number of laser pulses applied. Micromachining is also used to make long, deep, multiple channels in capacitance layers. When these channels are filled with metal, the spacings between two metallized channels acted as individual vertical capacitors, and parallel connection eventually produce vertical multilayer capacitors. For a given volume of capacitor material, theoretical capacitance calculations are made for variable channel widths and spacings. For comparison, calculations are also made for a “normal” capacitor, that is, a horizontal capacitor having a single pair of electrodes.Research limitations/implicationsThis technique can be used to prepare capacitors of various thicknesses from the same capacitance layer, and ultimately can produce variable capacitance density, or a library of capacitors. The process is also capable of making vertical 3D multilayer embedded capacitors from a single capacitance layer. The capacitance benefit of the vertical multilayer capacitors is more pronounced for thicker capacitance layers. The application of a laser processing approach can greatly enhance the utility and optimization of new materials and the devices formed from them.Originality/valueLaser micromaching technology is developed to fabricate several new structures. It is possible to synthesize nano and micro particles from thin film surfaces. Laser micromachining can produce a variety of random, as well as regular, 3D patterns. As the demand grows for complex multifunctional embedded components for advanced organic packaging, laser micromachining will continue to provide unique opportunities.

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A direct‐writing approach to the micro‐patterning of copper onto polyimide

Cited by 17 publications

References 56 publications

Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

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