2007 European Microwave Conference 2007
DOI: 10.1109/eumc.2007.4405397
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A differential SiP (LNA-filter-mixer) in silicon technology for the SKA project

Abstract: Abstract-This paper describes two filters realised in a technology entirely dedicated to passive components and which allows active dies flip-chip by means of bumps. Then, it presents the design of a SiP (System in Package) constituted of a differential LNA (Low Noise Amplifier) and mixer flipped respectively in front and back of a balanced filter. Measurements of a SiP, where just the LNA is flipped onto the filter, are shown in the last part.

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“…Unlike other research that has implemented PCBs or different substrates, using the glass IPD technology can effectively improve the circuit area without affecting circuit performance. The most important outcome is that a full differential bandpass filter using glass IPD technology is easily integrated with SiP applications [26][27][28][29][30] and enhances system design flexibility.…”
Section: Introductionmentioning
confidence: 99%
“…Unlike other research that has implemented PCBs or different substrates, using the glass IPD technology can effectively improve the circuit area without affecting circuit performance. The most important outcome is that a full differential bandpass filter using glass IPD technology is easily integrated with SiP applications [26][27][28][29][30] and enhances system design flexibility.…”
Section: Introductionmentioning
confidence: 99%