2020 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE) 2020
DOI: 10.23919/date48585.2020.9116278
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A DFT Scheme to Improve Coverage of Hard-to-Detect Faults in FinFET SRAMs

Abstract: Manufacturing defects can cause faults in FinFET SRAMs. Of them, easy-to-detect (ETD) faults always cause incorrect behavior, and therefore are easily detected by applying sequences of write and read operations. However, hard-to-detect (HTD) faults may not cause incorrect behavior, only parametric deviations. Detection of these faults is of major importance as they may lead to test escapes. This paper proposes a new designfor-testability (DFT) scheme for FinFET SRAMs to detect such faults by creating a mismatc… Show more

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Cited by 5 publications
(10 citation statements)
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“…Weak-read test mode [22] applies voltage stress by creating a mismatch on the SA and biasing the amplification phase during a read operation. Thus, this kind of test fully covers random read functional HTD faults as it forces an incorrect behavior; other HTD faults are not targeted and therefore are not covered.…”
Section: B Previously Proposed Test Solutionsmentioning
confidence: 99%
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“…Weak-read test mode [22] applies voltage stress by creating a mismatch on the SA and biasing the amplification phase during a read operation. Thus, this kind of test fully covers random read functional HTD faults as it forces an incorrect behavior; other HTD faults are not targeted and therefore are not covered.…”
Section: B Previously Proposed Test Solutionsmentioning
confidence: 99%
“…Combining test solutions to improve overall coverage: as shown in Table VIII and Fig. 7, dedicated DFT circuits have been developed targeting HTD faults; some of them use the same SCs to detect different faults, e.g., voltage is used by the DFT circuit in [22] to detect random read faults, and in the DFT circuit in [20] to detect undefined state faults. Combining somewhat similar test solutions would increase the overall HTD faults coverage.…”
Section: Test Solutions Outlookmentioning
confidence: 99%
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“…Hence, efficient techniques for production testing and for periodic maintenance testing are mandatory to guarantee the required quality standards. However, advances in memory technology and system design have turned memory testing into a nontrivial task [ 2 , 3 , 4 ]. The complexity of the memory chips makes fault modeling and testing an evermore challenging problem.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, more complex test solutions (e.g., more extreme stressing conditions and Design-for-Testability (DFT) circuits) must be used when targeting RRFs. Examples of such test solutions are schemes that change how read operations are executed [13][14][15], and schemes that monitor memory parameters [16][17][18]. However, both approaches have limitations; the former may over-test the memory due to inappropriate stresses, thus leading to yield loss, while the latter may be negatively impacted by process variation (PV) effects, thus leading to test escapes.…”
Section: Introductionmentioning
confidence: 99%