A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

Dong, Yunfeng; Zhurbenko, Vitaliy; Hanberg, Peter Jesper; Johansen, Tom K.

doi:10.1007/s10762-018-0551-x

Cited by 11 publications

(5 citation statements)

References 24 publications

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“…Different packaging solutions have been proposed, and many of them require a PCB. PCB introduces big loss at high frequencies, which is desired to be avoided in high frequency packaging solutions [ 22 , 23 , 24 , 25 ]. A novel substrate-less packaging solution is proposed in the design of the tag module.…”

Section: Tag Hardware and Test Resultsmentioning

confidence: 99%

Millimeter-Wave Multi-Channel Backscatter Communication and Ranging with an FMCW Radar

Wymeersch

et al. 2022

Sensors

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A multi-channel backscatter communication and radar sensing system is proposed and demonstrated in this paper. Frequency modulated continuous wave (FMCW) radar ranging is integrated with simultaneous uplink data transmission from a self-packaged active radio frequency (RF) tag. A novel package solution is proposed for the RF tag. With the proposed package, the RF tag can transmit a 32-QAM signal up to 2.5 Gbps and QPSK signal up to 8 Gbps. For a multi-tag scenario, we proposed using spread spectrum code to separate the data from each tag. In this case, tags can be placed at arbitrary locations without adjacent channel interference. Proof-of-concept simulations and measurements are demonstrated. A 625 Mbps data rate is achieved in a dual-tag scenario for two tags.

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Section: Tag Hardware and Test Resultsmentioning

confidence: 99%

Millimeter-Wave Multi-Channel Backscatter Communication and Ranging with an FMCW Radar

Wymeersch

et al. 2022

Sensors

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“…Wideband on-chip antennas could eliminate the need f or external off-chip connection, and innovative packaging processes have been proposed, but efficiency is low. Carrier substrate approach using wire bonding probe transition shows good versatility [29][30][31][32][33]. However, the external probes usually need an aperture cut in the center of the broad wall of waveguide line, which introduce the complexity for module fabrication and assembly.…”

Section: Mmic To Gwg Transition Designmentioning

confidence: 99%

Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

Yu¹,

Wang²,

He³

2023

Prime Archives in Sensors

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Author Contributions: W.Y. develop the chip packaging, performed simulation experiments, cataloged references, analyzed measurements, and wrote the manuscript; A.V. develop the chip packaging ,completed the chip packaging test, and sorted the results; B.W. conducted simulation experiments and participated in the writing of the manuscript; Z.S.H. proposed design and experimental ideas, and participated in the revision of the paper. All authors have read and agreed to the published version of the manuscript.

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“…In [108] for example, a DRA-based WGL on top of a CMOS die achieved an insertion loss of 2-3 dB over an approximate 15% bandwidth at 140 GHz. A bondwire E-probe presented in [109] achieves a maximum of 1.1 dB insertion loss throughout a bandwidth spanning nearly the entire D-band.…”

Section: B D-band Interconnectsmentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

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A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

Cited by 11 publications

References 24 publications

Millimeter-Wave Multi-Channel Backscatter Communication and Ranging with an FMCW Radar

Millimeter-Wave Multi-Channel Backscatter Communication and Ranging with an FMCW Radar

Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

A Review of Design and Integration Technologies for D-Band Antennas

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