2022
DOI: 10.1063/5.0076658
|View full text |Cite
|
Sign up to set email alerts
|

A Cu/P-type GaN triboelectric nanogenerator with power density over 100 W/m2

Abstract: The metal-semiconductor direct current triboelectric nanogenerator (MSDC-TENG) has attracted increasing attention due to its power density, which is 102−103 times higher than traditional generators. A P-type GaN based MSDC-TENG with a tin electrode is reported in this paper. By adjusting the Mg2+ doping concentration of the P-GaN, it can achieve an open circuit voltage (Voc) of 14.2 V and a short circuit current (Isc) density of ∼25.5 A/m2. This Isc is about 50 times higher than the performance of the Cu/GaN T… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
7
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
6

Relationship

2
4

Authors

Journals

citations
Cited by 11 publications
(7 citation statements)
references
References 20 publications
0
7
0
Order By: Relevance
“…Upon adjusting the carrier concentration of p-GaN, the power density was over 100 W/ m 2 when the friction area was 1.5 × 1.5 mm 2 . 19 At the beginning of our research, the performance of the new Cu/ GaN MSDC-TENG prepared by us was not satisfactory (V oc ≈ 5.6 V, I sc density ≈ 0.5 A/m 2 ). With the increase of carrier…”
Section: Metal−semiconductor Tengmentioning
confidence: 78%
See 3 more Smart Citations
“…Upon adjusting the carrier concentration of p-GaN, the power density was over 100 W/ m 2 when the friction area was 1.5 × 1.5 mm 2 . 19 At the beginning of our research, the performance of the new Cu/ GaN MSDC-TENG prepared by us was not satisfactory (V oc ≈ 5.6 V, I sc density ≈ 0.5 A/m 2 ). With the increase of carrier…”
Section: Metal−semiconductor Tengmentioning
confidence: 78%
“…In particular, our group doped the third-generation semiconductor material GaN with Mg 2+ to form p-GaN and improved the current density of a Cu/p-GaN triboelectric nanogenerator (Figure a). Upon adjusting the carrier concentration of p-GaN, the power density was over 100 W/m 2 when the friction area was 1.5 × 1.5 mm 2 . At the beginning of our research, the performance of the new Cu/GaN MSDC-TENG prepared by us was not satisfactory ( V oc ≈ 5.6 V, I sc density ≈ 0.5 A/m 2 ).…”
Section: Metal–semiconductor Tengmentioning
confidence: 79%
See 2 more Smart Citations
“…Dynamic semiconductor physics has emerged as the platform of exploring the novel semiconductor devices since the dynamic Schottky diode has been proposed [1,2]. Since the discovery of DD in 2018 [1], the novel and ultrafast mechanical-electrical coupling process at the solid-solid/solid-liquid interfacial barrier has been taken seriously due to groundbreaking physical picture, especially the unusual excitation, rebound, and transport of HCs induced by the mechanical input, which has brought the births of various evidences including the dynamic PN/Schottky/heterojunction [1,[3][4][5][6][7][8][9][10], polarized solution based DD [11,12], tunneling DD [2,10], and nonlinear synergy DD [13][14][15][16]; some excellent characters like direct-current output, high current density, flexibility, suitable inner resistance, and easy fabrication have also been proven [1,2,5], and the integrable ability has also been illustrated in recent works [17][18][19].…”
Section: Introductionmentioning
confidence: 99%