A cracked polymer templated metal network as a transparent conducting electrode for ITO-free organic solar cells

Rao, K. D. M.; Hunger, Christoph; Gupta, Ritu; Kulkarni, Giridhar U.; Thelakkat, Mukundan

doi:10.1039/c4cp02250e

Cited by 58 publications

(73 citation statements)

References 40 publications

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“…Large area Cu TCE by a complete solution process was realized (Figure 3d) which showed better stability than Cu nanowire based networks [72 ]. Using such TCEs, ITO-free solar cells have been demonstrated [73]. Uniformity of metal mesh distribution is evident from IR camera images of flexible heater fabricated on PET substrates (Figure 3e) [71 ].…”

Section: Template Based Network Lithography Processesmentioning

confidence: 95%

Towards low cost materials and methods for transparent electrodes

Kulkarni

Kiruthika

Gupta

et al. 2015

Current Opinion in Chemical Engineering

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Section: Template Based Network Lithography Processesmentioning

confidence: 95%

Towards low cost materials and methods for transparent electrodes

Kulkarni

Kiruthika

Gupta

et al. 2015

Current Opinion in Chemical Engineering

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“…Here, we developed inexpensive metallic ribbon networks (MRNs) by employing the self‐cracking technique, pioneered by members of our team, and subsequently used by other groups . We demonstrate, that the nanoribbon character of our network allows for an extraordinary reduction of the network resistance after electroplating, with only minimal reduction in transmission.…”

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confidence: 96%

“…Transparent conducting electrodes (TCEs) are essential components of many applications, such as solar cells, light emitting diodes (LEDs), light sources based on LED, touch‐screen displays, wearable electronics, etc . Doped‐metal oxide films such as the tin‐doped indium oxide (ITO) have dominated the field so far, but due to their brittleness and relatively high cost cannot be used in the new‐class of flexible devices . Recently, development of TCEs based on new materials, such as graphene, carbon nanotubes, nanowires, as well as their combinations opened the possibility for a viable ITO replacement .…”

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confidence: 99%

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Colossal Figure of Merit in Transparent‐Conducting Metallic Ribbon Networks

Peng

Han

et al. 2016

Adv Materials Technologies

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in the morphology of the seed-layer is needed for successful applications.Here, we developed inexpensive metallic ribbon networks (MRNs) by employing the self-cracking technique, pioneered by members of our team, [ 18 ] and subsequently used by other groups. [ 7,32 ] We demonstrate, that the nanoribbon character of our network allows for an extraordinary reduction of the network resistance after electroplating, with only minimal reduction in transmission. The resulting network achieves a record high fi gure of merit of over 30 000. Networks with such ultralow resistance are desired for high power LED light sources.The fabrication process includes four steps, shown schematically in Figure 1 a. First, is the formation of a self-cracking egg white sacrifi cial mask (yellow layer). Second, deposition of the seed-layer metal network (black layer) by sputtering or possibly by a solution process (work in progress). The sacrifi cial layer removal represents the third step, and fi nally the fourth step is the deposition of the electroplating layer (red layer). Figure 1 b shows the schematic of the electroplating process: simply biasing the network relative to the reference electrode in a solution containing metal ions leads to metal build-up on the metal ribbon network (pink layer). Figure 2 a shows a SEM image of an Ag seed-layer MRN on a PET substrate (surface roughness of a seed-layer MRN see Figure S1a, Supporting Information); each line is a ribbon of ≈60 nm thick and a few micrometer wide. The inter-ribbon spacing is in the range of 20-100 µm. We can roughly control the linewidth and inter-ribbon spacing by changing the concentration of sacrifi cial materials (e.g., egg white), spinning speed, and duration; for details see Table S1 of the Supporting Information. The inset in Figure 2 a shows a magnifi ed view of the fl at ribbon junction. Note, that it is this ribbon character, and overall scale that allows for substantial metal over coating, without signifi cantly reducing transmission. For example, a very large 5 µm overcoat by plating increases 100 times the line thickness (i.e., reduces resistance 100 times), but reduces the inter-ribbon distance by only 10%, and therefore the transmission by about 20%. This is the ribbon effect, discussed in more detail further below. Figure 2 b is a SEM image of the Ag based MRNs, with the seed layer (marked A) on the left and silver-plated section (marked B) seen on the right; this section was immersed in the plating solution (shown in Figure 1 b). Figure 2 c is a SEM image of a plated MRN with uniform metal network coverage (surface roughness of a plated MRN see Figure S1b, Supporting Information). The top inset shows the side-view, confi rming high uniformity of the plating process (height profi le of a plated MRN see Figure S1c, Supporting Information); the bottom inset Transparent conducting electrodes (TCEs) are essential components of many applications, such as solar cells, light emitting diodes (LEDs), light sources based on LED, touch-screen displays, wearable electro...

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“…Optoelectronic properties of metallic networks. a) Optical transmittance of metallic networks as a function of sheet resistance (in comparison to crack Cu NWs, plating Ag mesh, Ag NWs, electrospun Ag NWs, graphene, dry transfer Ag NWs, PEDOT:PSS, sputter Ag mesh, Cu mesh, and ITO). The solid lines represent Equation for the given values of F .…”

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A Practical ITO Replacement Strategy: Sputtering‐Free Processing of a Metallic Nanonetwork

Xian

Han

et al. 2017

Adv Materials Technologies

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Metallic network, an important indium tin oxide (ITO) replacement, is extensively studied due to its advantages in optoelectronic properties and mechanical flexibility. Vacuum sputtering/evaporation‐free processing is an essential step for roll‐to‐roll production of low‐cost and large‐size metallic network transparent electrodes. In this paper, a high performance metallic crack‐nanonetwork (CNN) is demonstrated by employing a sputtering/evaporation‐free process, which combines advantages of the standard CNN processing with electroless plating, enabled by unique properties of the commercial amorphous fluoropolymer CYTOP. This network shows outstanding optoelectronic performance, with the best figure of merit ≈ 20000 (at T ≈ 86.4% and Rs ≈ 0.13 Ω sq−1), as well as excellent mechanical flexibility and stability. This network outperforms the current industry standard, ITO, in performance and cost, as a result of the elimination of the sputtering/evaporation step. This is therefore a dramatic step toward replacing ITO with a metallic cracking nanonetwork.

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A cracked polymer templated metal network as a transparent conducting electrode for ITO-free organic solar cells

Cited by 58 publications

References 40 publications

Towards low cost materials and methods for transparent electrodes

Towards low cost materials and methods for transparent electrodes

Colossal Figure of Merit in Transparent‐Conducting Metallic Ribbon Networks

A Practical ITO Replacement Strategy: Sputtering‐Free Processing of a Metallic Nanonetwork

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