A contribution to the flow behaviour of thin polymer films during hot embossing lithography

Scheer, Hella-Christin; Schulz, H.

doi:10.1016/s0167-9317(01)00569-x

Cited by 202 publications

(119 citation statements)

References 14 publications

Supporting

Mentioning

112

Contrasting

Order By: Relevance

“…For a wetting fluid having a small contact angle with the master sidewall, the fluid will wet the master surface and climb the indenter sidewalls in a dual peak mode, independent of W/h i . This wetting behavior has been observed by [8,9,20]. The deformation behavior for a nonwetting fluid is more complex than for a wetting fluid, and can depend on surface tension, contact angle, viscosity, pressure, film thickness, and cavity spacing.…”

Section: Discussionmentioning

confidence: 62%

See 1 more Smart Citation

Impact of polymer film thickness and cavity size on polymer flow during embossing : towards process design rules for nanoimprint lithography.

Schunk¹,

King

Sun³

et al. 2006

View full text Add to dashboard Cite

This paper presents continuum simulations of polymer flow during nanoimprint lithography (NIL). The simulations capture the underlying physics of polymer flow from the nanometer to millimeter length scale and examine geometry and thermophysical process quantities affecting cavity filling. Variations in embossing tool geometry and polymer film thickness during viscous flow distinguish different flow driving mechanisms. Three parameters can predict polymer deformation mode: cavity width to polymer thickness ratio, polymer supply ratio, and Capillary number. The ratio of cavity width to initial polymer film thickness determines vertically or laterally dominant deformation. The ratio of indenter width to residual film thickness measures polymer supply beneath the indenter which determines Stokes or squeeze flow. The local geometry ratios can predict a fill time based on laminar flow between plates, Stokes flow, or squeeze flow. Characteristic NIL capillary number based on geometry-dependent fill time distinguishes between capillary or viscous driven flows. The three parameters predict filling modes observed in published studies of NIL deformation over nanometer to millimeter length scales. The work seeks to establish process design rules for NIL and to provide tools for the rational design of NIL master templates, resist polymers, and process parameters. 4

show abstract

Section: Discussionmentioning

confidence: 62%

“…All of the referenced studies state that decreasing h i or increasing h c /h i increases either the filling time [7,8,20] or the filling pressure [10,11]. For the present viscous liquid simulations, time and pressure are linearly related in the non-dimensionalization.…”

Section: Discussionmentioning

confidence: 85%

Impact of polymer film thickness and cavity size on polymer flow during embossing : towards process design rules for nanoimprint lithography.

Schunk¹,

King

Sun³

et al. 2006

View full text Add to dashboard Cite

show abstract

“…A simple theory was used to estimate the embossing time required to fill a given stamp geometry. In both cases there is evidence of compression causing buckling of the polymer and also capillary action drawing the polymer up to the top of the stamp cavity (Scheer & Schulz, 2001). Heyderman et al, thought that the time to fill a nanostructure array with a large unstructured surrounding area is the same for a microcavity with the same surrounding area and cavity volume.…”

Section: Filling Processmentioning

confidence: 99%

“…A fiducial grid was embedded in the polymer layer being imprinted, and they observed its distortions after imprinting (Macintyre & Thoms, 2005). Scheer and Schultz recorded wave-like fronts of resist moving between the stamp and the substrate during imprinting processes operating at more than 100 bar (Scheer & Schulz, 2001). The mechanism in the low-pressure/high-temperature imprinting depends on the type of mold used.…”

Section: Filling Processmentioning

confidence: 99%

Nanoimprint Lithography

강신일¹

2016

Encyclopedia of Nanotechnology

View full text Add to dashboard Cite

“…One popular model for the hot embossing process is the squeeze film effect from hydrodynamic theory (Scheer and Schulz 2001). Assuming the polymer to be exhibiting ideal fluid behaviour, a fluid pressure distribution will exist in the polymer subject to changes in the polymer film thickness.…”

Section: Polymer Flow: Thick Film Versus Thin Filmmentioning

confidence: 99%

Development of a multi-layer microelectrofluidic platform

Wang

Tjeung

et al. 2007

Microsyst Technol

View full text Add to dashboard Cite

We report on the development of process capabilities for a polymer-based, multi-layer microelectrofluidic platform, namely: the hot embossing process, metallization on polymer and polymer bonding. Hot embossing experiments were conducted to look at the effects of load applied, embossing temperature and embossing time on the fidelity of line arrays representing micro channels. The results revealed that the embossing temperature was a more sensitive parameter than the others due to its large effect on the polymer material's viscoelastic properties. Dynamic mechanical analysis (DMA) conducted on polymethyl methacrylate (PMMA) revealed a steep glass transition over a 20°C range, with the material losing more than 95% of its storage modulus. The data explained the hot embossing results, which showed large changes in the embossed channel dimensions when the temperature was within the glass transition range. It was demonstrated that the micro-printing of silver epoxy was a possible low-cost technique in the mass production of disposable lab chips. An interconnecting, three-dimensional network of electrical traces was fabricated, as well as a microfluidic device with interconnecting, three-dimensional network of micro channels.

show abstract

A contribution to the flow behaviour of thin polymer films during hot embossing lithography

Cited by 202 publications

References 14 publications

Impact of polymer film thickness and cavity size on polymer flow during embossing : towards process design rules for nanoimprint lithography.

Impact of polymer film thickness and cavity size on polymer flow during embossing : towards process design rules for nanoimprint lithography.

Nanoimprint Lithography

Development of a multi-layer microelectrofluidic platform

Contact Info

Product

Resources

About