A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

Abstract

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Monitoring of Vital Signs with Flexible and Wearable Medical Devices

“…[ 9,98 ] Transferring prefabricated devices on silicon can be done using several techniques. A packaged integrated circuit package may fl ip chip bonded or pick-and-placed onto an elastomeric substrate using a low-temperature solder [ 8 ] or adhesive printed electrodes [ 99 ] as shown in Table 2 . Devices fabricated on a wafer may also be transferred directly onto an elastomeric substrate such as PDMS by performing a wet etch underneath the fabricated device to loosen the foundation.…”