A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

Niu, Yuling; Wang, Jing; Shao, Shuyan; Wang, Huayan; Lee, Hohyung; Park, Seungbae

doi:10.1016/j.microrel.2018.06.006

Cited by 24 publications

(7 citation statements)

References 16 publications

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“…The reliability assessment of electronic packages using Digital Image Correlation (DIC) was done by Niu et al. 12 According to the results of the study, it can be concluded that for reliability assessment, generally analytical and simulation-based methods are implemented. In analytical techniques mathematical expressions are used to evaluate average value of reliability indices.…”

Section: Reliability Assessment Methodsmentioning

confidence: 99%

Real time reliability monitoring of hydro‐power plant by combined cognitive decision‐making technique

Majumder

Saha

et al. 2019

Int J Energy Res

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Summary Hydro power plants are one of the most cost‐effective renewable technologies which have the potential to replace the conventional fuels. However, reliability of the plant varies with time due to irregularity in flow pattern of the river which depends on the pattern of climatic parameters like precipitation and evapo‐transpiration. The reliability of the plant performance also varies with the efficiency of the power equipment and conveyance coefficient of penstock, both of which are time dependent. When reliability reduces, performance efficiency also gets degraded. That is why, monitoring of reliability in hydro power plants is essential and required to be conducted periodically. But at present, such activities are expensive due to the requirement of extensive surveys, data collection and performance audits of the equipment and structures involved in the power production. There is a lack of single indicator based real time monitoring processes which can be utilized to continuously regulate the reliability of the power plant. Such system can reduce both cost and time required for conducting reliability assessment procedures. That is why, in the present study, an objective and cognitive technique was utilized to develop a single index for real time monitoring of the reliability of a power plant. The results indicate that efficiency of generator, levelized cost of electricity and rate of selling per unit electricity are the most significant indicator which have the capability to represent reliability. A model developed for the present study by Polynomial Neural Network also ensures that regular monitoring of reliability of an HPP is possible.

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Section: Reliability Assessment Methodsmentioning

confidence: 99%

Real time reliability monitoring of hydro‐power plant by combined cognitive decision‐making technique

Majumder

Saha

et al. 2019

Int J Energy Res

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“…For single polymer-based materials, bottom fillers are generally a good fit for Fick diffusion in terms of moisture absorption; however, for mold compounds, no Fick diffusion is evident, even during standard testing. In electronic packaging, the discontinuity of materials under heterogeneous integration also causes the discontinuity of moisture concentration diffusion, and Fick’s law cannot be applied simply by analogy with thermal diffusion [ 25 , 26 ]. So Wong et al [ 27 ] proposed the normalization method: introduce the normalized wet concentration

(the ratio of wet concentration to saturated wet concentration,

) to solve the problem of discontinuity of different interfacial parameters of the two phases of the material:

…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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“…Many essential advances have been made, making DIC one of the most popular and practical measurement techniques. Meanwhile, over the years, the DIC technique has been extended from the initial displacement analysis in metal detection to many other fields such as biomechanics (Palanca et al, 2016), civil engineering (Ramos et al, 2015), aerospace (Chu and Poudel, 2014), electronics (Niu et al, 2018) and so on. In addition, with the advent of atomic force microscopy, transmission electron microscopy and scanning tunneling microscopy, DIC is widely used for microscopic observation (Budyn et al, 2012).…”

Section: Introductionmentioning

confidence: 99%

Digital image correlation for sensing kinematic fields in manufacturing processes: a review

Zhu

Zhang

Zou

2021

JIMSE

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PurposeThe purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.Design/methodology/approachNo methodology was used because the paper is a review article.Findingsno fundings.Originality/valueHerein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

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A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

Cited by 24 publications

References 16 publications

Real time reliability monitoring of hydro‐power plant by combined cognitive decision‐making technique

Real time reliability monitoring of hydro‐power plant by combined cognitive decision‐making technique

Delamination of Plasticized Devices in Dynamic Service Environments

Digital image correlation for sensing kinematic fields in manufacturing processes: a review

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