2019
DOI: 10.1109/tvlsi.2019.2904197
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A Comprehensive Framework for Parametric Failure Modeling and Yield Analysis of STT-MRAM

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Cited by 10 publications
(4 citation statements)
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“…affected by variations due to the combined effect of these two processes. Permanent faults in MRAM can be caused by extreme parametric variations, as described in [43] and [44]. These variations come from changes in both material and lithographic properties, transistor electrical properties, and noise generated by thermal effects [41], [42].…”
Section: ) Strong or Weak Defectsmentioning
confidence: 99%
“…affected by variations due to the combined effect of these two processes. Permanent faults in MRAM can be caused by extreme parametric variations, as described in [43] and [44]. These variations come from changes in both material and lithographic properties, transistor electrical properties, and noise generated by thermal effects [41], [42].…”
Section: ) Strong or Weak Defectsmentioning
confidence: 99%
“…Overall design and reliability analysis framework used in this project is depicted in In this project, we have developed model for both reliability failures such as read/write failures, read-disturb and retention failures as well as permanent faults due to parametric variations of the STT-MRAM. The yield analysis flow is presented in detail in [10]. The parameters considered in our analysis are the radius (r) of the MTJ and the threshold voltage (V th ) of all CMOS components.…”
Section: Frameworkmentioning
confidence: 99%
“…Fig.5: Percentage of chips with their fault types for a 512×512 memory at 25 • C for various correlation coefficients (φ)[10].…”
mentioning
confidence: 99%
“…MRAM scanning is much faster than DRAM and SRAM. MRAM shows poor writing performance but is hidden in FPGAs [14]. When FPGAs are used as accelerators, LUT only performs memory scanning functions to scan the associated logic.…”
Section: Introductionmentioning
confidence: 99%