A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

Li, Jiujuan; Zhou, Guoyun; Yan, Hong; He, Wei; Wang, Shouxu; Yang, Wenjun; Su, Xinhong; Hu, Yongsuan; Feng, Xia; Jin, Xigao

doi:10.1007/s10854-018-8979-2

Cited by 4 publications

(1 citation statement)

References 23 publications

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“…The additive process is the hotspot of current research for fabricating flexible conductive patterns. − Particularly, printing nanosized metal inks and selective metal electroless deposition (ELD) are both common approaches due to the excellent electrical conductivity and flexibility of metals. However, nanosized metal in inks will spontaneously agglomerate and block nozzles during the printing procedure.…”

Section: Introductionmentioning

confidence: 99%

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Wang

Yan

Zhou

et al. 2019

ACS Appl. Mater. Interfaces

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Firm immobilization of catalysts on the predesigned position over substrates is an essential process for producing flexible circuits by the electroless deposition (ELD) process. In this work, a compatible Ag + complex was developed and directly printed on the poly(ethylene terephtalate) (PET) film through a micro inkjet printing instrument to trigger the deposition of ultrafine copper patterns with approximately 20 μm in width. Morphological and elementary characterization verified that the nanosized silver catalyst was uniformly distributed in the bridge layer, which could enhance the adhesion between the PET film and deposited copper patterns. Moreover, after 30 min of ELD, the copper patterns exhibited a low resistivity of 2.68 × 10 −6 Ω•cm and maintained considerable conductivity even after 2000 times of cyclical bending. These interesting conductive and mechanical features demonstrate the tremendous potential of this Ag + complex-assisted copper deposition in the interconnection of high-density integrated flexible electronics.

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Section: Introductionmentioning

confidence: 99%

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Wang

Yan

Zhou

et al. 2019

ACS Appl. Mater. Interfaces

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Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Xiang

Zhou

Yan

et al. 2022

Applied Surface Science

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Redetermination of low-temperature heat capacity of Cu(C5H7O2)2

Bespyatov

2019

The Journal of Chemical Thermodynamics

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A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

Cited by 4 publications

References 23 publications

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Redetermination of low-temperature heat capacity of Cu(C5H7O2)2

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A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

Cited by 4 publications

References 23 publications

Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Redetermination of low-temperature heat capacity of Cu(C5H7O2)2

Contact Info

Product

Resources

About

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing