Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

“…1,2 Accordingly, fabrication of conductive patterns on flexible substrates, e.g. , polyimide 3,4 and paper, 5–7 has attracted much attention, with the process roughly proceeding via two consecutive steps, i.e. , the deposition of electrical/conductive materials and subsequent conversion of printed patterns into conductive components.…”

Manufacture of complex pattern flexible copper microcircuits based on silver seeds through chemical growth welding

“…[9][10][11][12] Therefore, the electroless plating at near room temperature shows unusual potential. [13][14][15][16][17][18][19][20][21][22][23] The chemical copper plating process generally involves three steps: the modification of flexible substrates, the reduction of catalytic seeds, and the growth of copper microcircuits. 16,18,[24][25][26] Chen et al 27 modified polyimide (PI) films using a strong alkaline solution, and subsequently printed Cu(II) ink and reductive ink respectively to form copper nanoparticle catalytic patterns.…”

Flexible Copper Metal Circuits via Desktop Laser Printed Masks

“…A number of approaches have been described in the literature on using electroless deposition for patterning copper onto polyimide, using either silver or palladium as a catalyst. [23][24][25][26][27][28][29][30] Patterning has been achieved using techniques such as photolithography, direct laser writing, ink-jet printing, ion implantation, and microcontact printing to spatially control chemical reactions at the surface. The majority of these approaches require vastly more expensive experimental equipment than what is described here.…”