2018
DOI: 10.1016/j.jallcom.2017.09.336
|View full text |Cite
|
Sign up to set email alerts
|

A comparative study of wet etching and contacts on (2¯01) and (010) oriented β-Ga2O3

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

1
34
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 60 publications
(35 citation statements)
references
References 39 publications
1
34
0
Order By: Relevance
“…As highlighted with pink, the (true2¯01) plane is especial in β‐Ga 2 O 3 because only O atoms or Ga atoms existing in this plane. [ 27 ] Figure 3b shows a (true2¯01) plane terminated with O atoms only. These O atoms exhibit a hexagonal arrangement, similar to the O atoms in the (0001) plane of sapphire shown in Figure 3c.…”
Section: Resultsmentioning
confidence: 99%
“…As highlighted with pink, the (true2¯01) plane is especial in β‐Ga 2 O 3 because only O atoms or Ga atoms existing in this plane. [ 27 ] Figure 3b shows a (true2¯01) plane terminated with O atoms only. These O atoms exhibit a hexagonal arrangement, similar to the O atoms in the (0001) plane of sapphire shown in Figure 3c.…”
Section: Resultsmentioning
confidence: 99%
“…Zhang et al investigated the anisotropic etching behavior of β-Ga 2 O 3 and showed that the wet etching in hot phosphoric acid could effectively reduce the sidewall roughness caused by plasma dry etching [18]. Jang et al found that ( 2 01) Ga 2 O 3 had higher etch rates and could form ohmic contacts more easily than (010) Ga 2 O 3 , which was correlated with the higher density of oxygen dangling bonds on the ( 2 01) plane [19]. Sasaki et al found that the epitaxial growth rate for (100) plane was lower than (010) plane because of the low adhesion energy on the terraces for (100) surface [20].…”
Section: Introductionmentioning
confidence: 99%
“…The pattern transfer can be carried out by either wet etching or dry etching. There have been some reports on the wet etching of β-Ga 2 O 3 [19][20][21][22][23], but it is very difficult to produce [24,25]. Dry etching techniques utilizing a high density plasma source, such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR), have been shown to produce higher etch rates for GaN and SiC compared to conventional reactive ion etching (RIE) and chemically-assisted ion beam etching (CAIBE) [26][27][28][29][30].…”
Section: Introductionmentioning
confidence: 99%