A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Lai, Wei‐Hong; Yang, Penny; Hu, Ian; Liao, Tse-Wei; Chen, KarenYU; Tarng, David; Hung, Chih-Pin

doi:10.1109/ectc32862.2020.00064

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020

DOI: 10.1109/ectc32862.2020.00064

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A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Wei‐Hong Lai

Penny Yang

Ian Hu

et al.

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Cited by 26 publications

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A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Cited by 26 publications

References 9 publications

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2D, 2.1D, and 2.3D IC Integration

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