2020 IEEE International Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMCSI) 2020
DOI: 10.1109/emcsi38923.2020.9191559
|View full text |Cite
|
Sign up to set email alerts
|

A collaborative optimization for floorplanning and pin assignment of 3D ICs based on GA-SA algorithm

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
4
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(4 citation statements)
references
References 6 publications
0
4
0
Order By: Relevance
“…Various algorithms exist to group and slice up the cell into the gate level net-list according to parameters such as maximum interconnect length and logical depth. One such algorithm is the Genetic and Simulated Annealing (GSA) algorithm [25], which is used to define weight values for different cells while clustering them to perform efficient placement. The macro placement has further been explored as a fully automated solution using machine learning models in [26].…”
Section: Literature Reviewmentioning
confidence: 99%
“…Various algorithms exist to group and slice up the cell into the gate level net-list according to parameters such as maximum interconnect length and logical depth. One such algorithm is the Genetic and Simulated Annealing (GSA) algorithm [25], which is used to define weight values for different cells while clustering them to perform efficient placement. The macro placement has further been explored as a fully automated solution using machine learning models in [26].…”
Section: Literature Reviewmentioning
confidence: 99%
“…The pin assignment is one of the most important problems to reduce wirelength meanwhile optimizing both critical delay and power consumption in M3D integration [5], [6]. Previously, the pin assignment in M3D has been optimized by simultaneous optimization of pin assignment, TSV placement [8], and genetic and simulated annealing algorithm to co-optimize area, wirelength, and temperature [9].…”
Section: Related Workmentioning
confidence: 99%
“…By formulating the problem as a min-cost multi-commodity flow model, they have improved the total wirelength of the target design by 38%. Hu et al [9] has proposed Genetic and Simulated Annealing (GA-SA) algorithm to find the optimal 3D IC floorplanning and assignments of on-chip and I/O package pins considering area, interconnection length, maximum temperature and inductance of pins of the design.…”
Section: Related Workmentioning
confidence: 99%
“…Therefore, we propose an improved PIO algorithm, called improved Metropolis criterion PIO (IMCPIO), inspired by the simulated annealing (SA) algorithm [7] and the Iterative Modified PSO (IMPSO) algorithm. The IMPIO algorithm has the following advantages over the basic PIO algorithm: (1) It allows inferior solutions to be accepted with a certain probability, which enables the algorithm to escape local optima and enhances its robustness; (2) It introduces a temperature parameter T, which decreases gradually.…”
Section: Introductionmentioning
confidence: 99%