A Cluster-Based Method for Quantitative Characterization and Uncertainty Evaluation of Areal Step Height in Structured Surface Metrology

Wang, Chen; Meng, Xianyu; Królczyk, Grzegorz M.; Wei, Heming

doi:10.1109/tim.2022.3205662

Cited by 2 publications

(1 citation statement)

References 25 publications

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“…For reconstruction accuracy assessment of the proposed method, we adopt the method proposed by Wang et al to calculate the height difference of the block samples [33]. First, we select an 800×800 area in each left and right region of the block and then compare the calculated results with the standard results.…”

Section: Quantitative Analysismentioning

confidence: 99%

Wafer Surface Reconstruction Based on Shape From Focus

Wang,

Chen,

Shi

et al. 2024

IEEE Access

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Scanning electron microscope, atomic force microscope and other equipment play an important role in the fields of topography restoration and detection. However, these devices are generally used in nanometer-scale measurement scenarios. For wafer topography quality control scenarios ranging from microns to hundreds of microns, these technologies have problems such as high cost and slow detection speed. Therefore, developing new, low-cost, and high-precision methods is necessary. To address this problem, a wafer surface reconstruction framework is proposed based on the shape-from-focus principle. In view of the characteristics of the large area and micro-small height of the wafer, to solve the limitations of the existing shape from focus framework, which is generally based on a single field, we created a multi-field image sequence rapid acquisition system and proposed the use of pulse control methods to achieve rapid acquisition of large area images. On the other hand, this paper proposes a dual filtering framework combining the Levy flight filtering principle with the SOR algorithm in point cloud filtering to achieve a balance between smoothing the depth map and maintaining the detailed structure, reducing the impact of noise, and improving the morphology restoration accuracy. To avoid splicing seams between fields, the progressive detection multifield stitching technique is used to complete large-area depth data stitching. Experiments were conducted on both synthetic and real objects to verify the effectiveness of the proposed method. In terms of synthesized images, the accuracy of the three methods significantly improved after applying the proposed method framework. After applying the Tenenbaum method framework, its correlation and peak signal-tonoise ratio improved by 7.5% and 38.2%, respectively, and its root mean square error was reduced by 40.7%. The excellent accuracy reconstruction results of the proposed method was verified through accuracy evaluation experiments. The height errors of the three methods used were all higher than 1 μm. However, after using the proposed method framework, the maximum error was only 0.24 μm. The experimental results indicated that this method overcomes the area limitation of traditional SFF and is suitable for applying wafer surface morphology measurements.

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Section: Quantitative Analysismentioning

confidence: 99%

Wafer Surface Reconstruction Based on Shape From Focus

Wang,

Chen,

Shi

et al. 2024

IEEE Access

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Phase-based reconstruction optimization method for digital holographic measurement of microstructures

Wang

Wei

et al. 2023

Appl. Opt.

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Digital holography has transformative potential in measuring stacked-chip microstructures due to its noninvasive, single-shot, full-field characteristics. However, uncertainties in reconstruction distance inevitably lead to resolving blur and reconstruction distortion. Herein, we propose a phase-based reconstruction optimization method that consists of a phase-evaluation function and a structured surface-characterization model. Our proposed method involves setting a reconstruction distance range, obtaining phase information using sliced numerical reconstruction, and optimizing the reconstruction distance by finding the extreme value of the function, which identifies the focal plane of the reconstructed image. The structure of the surface topography is then characterized using the characterization model. We perform simulations of the recording, reconstruction, and characterization to verify the effectiveness of the proposed method. To further demonstrate the approach, a simple holographic recording system is constructed to measure a standard resolution target, and the measurement results are compared with a commercial instrument. The simulation and experiment demonstrate, respectively, 31.16% and 34.41% improvement in step-height characterization accuracy.

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A Cluster-Based Method for Quantitative Characterization and Uncertainty Evaluation of Areal Step Height in Structured Surface Metrology

Cited by 2 publications

References 25 publications

Wafer Surface Reconstruction Based on Shape From Focus

Wafer Surface Reconstruction Based on Shape From Focus

Phase-based reconstruction optimization method for digital holographic measurement of microstructures

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