“…Various electrode materials such as silver paint [10], platinum [8,12], platinum-iridium [13], gold [14], copper [15], and aluminum [5,6] have been used as conductivity (both contact and contactless) detector electrodes and the fabrication process has usually involved various methods ranging from sputtering of the metal [6,8,12], physical placement of the electrode close to the separation channel [7], electron beam evaporator [14], or gluing either copper [15] or aluminum layers [5] onto the cover plate. While the photolithographic methods are difficult to carry out, other normal deposition methods such as sputtering and thermal or electron beam evaporation require etching steps and hence impose limitations in dimensions of the electrodes.…”