A blister test for interfacial adhesion of large-scale transferred graphene

Cao, Zhiyi; Wang, P.; Gao, Wei; Tao, Li; Suk, Ji Won; Ruoff, Rodney S.; Akinwande, Deji; Huang, Rui; Liechti, Kenneth M.

doi:10.1016/j.carbon.2013.12.041

Cited by 94 publications

(70 citation statements)

References 32 publications

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“…[12,13] In recent years, a large number of experimental studies of measuring interfacial adhesion energies between mechanically exfoliated graphene or chemically vapor deposited (CVD) graphene and support substrates have been reported by using the pressurized blister test with intercalated nanoparticles, [14] inflated air, [15,16] and deionized water, [17] double cantilever beam fracture mechanics test, [18] pleat defect measurement, [19] atomic force microscope (AFM) nanoindentation, [20][21][22] and optical fiber Fabry-Perot interference. [12,13] In recent years, a large number of experimental studies of measuring interfacial adhesion energies between mechanically exfoliated graphene or chemically vapor deposited (CVD) graphene and support substrates have been reported by using the pressurized blister test with intercalated nanoparticles, [14] inflated air, [15,16] and deionized water, [17] double cantilever beam fracture mechanics test, [18] pleat defect measurement, [19] atomic force microscope (AFM) nanoindentation, [20][21][22] and optical fiber Fabry-Perot interference.…”

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confidence: 99%

Measuring Graphene Adhesion on Silicon Substrate by Single and Dual Nanoparticle‐Loaded Blister

Gao

et al. 2017

Adv Materials Inter

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and various substrates is essential for graphene-based nanomechanical and nanoelectric devices. [12,13] In recent years, a large number of experimental studies of measuring interfacial adhesion energies between mechanically exfoliated graphene or chemically vapor deposited (CVD) graphene and support substrates have been reported by using the pressurized blister test with intercalated nanoparticles, [14] inflated air, [15,16] and deionized water, [17] double cantilever beam fracture mechanics test, [18] pleat defect measurement, [19] atomic force microscope (AFM) nanoindentation, [20][21][22] and optical fiber Fabry-Perot interference. [23] Although the discrepancy exists in the measurement results due to the nonuniformity of fabricated graphene membranes and principle errors of various measurement methods, these experimental studies have significantly advanced the understanding of graphene adhesion behaviors. Unfortunately, such approaches to determine the adhesion energy of graphene and a substrate typically involve specific measurement setups and professional sample fabrication or test procedures, as well as relatively complicated analytical models for adhesion energies. Even if for the AFM nanoindentation method recently utilized more, the extremely thin sheet is hard to handle and prone to damage by clamps and fixtures as in the conventional peel test, [14] and the effect of surface roughness of the spherical tip of AFM should be addressed by the modified Rumpf model. [21] Moreover, the disturbance of the pull-off instability generally occurs during the tip-sample interaction. [24] For this reason, a simple, general, and direct measurement of adhesion energy for graphene membranes on a variety of substrates is highly necessary.In this paper, we demonstrated an improved nanoscale quantification study of adhesion energy of CVD graphene membranes with different layer thicknesses on SiO 2 substrate, by directly measuring the size (diameter and height) of graphene bubbles covered with single and dual gold nanoparticles showing regular circular or elliptical geometries, respectively. This presented method differs from the aforementioned ref. [14] in which only isolated single particles with regular circular blister geometries are available. This resulting disadvantage is that the sample fabrication process is possibly repeated many times to achieve satisfactory results by locating those tiny regular single nanoparticles via scanning electron microscope (SEM). However, regular blister geometries formed by two particles can also contribute to the solution of interfacial adhesion energy of graphene on substrates. Hence, to extend the applicability and robustness of this presented method, a generalized van der Waals adhesion behavior at the interface between graphene and support substrates is important to characterize the performance of graphenebased sensors. Here an improved, general, and direct method of determining the adhesion energies of monolayer/few-layer/multilayer graphene sheets on silicon wafers is demonstra...

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Measuring Graphene Adhesion on Silicon Substrate by Single and Dual Nanoparticle‐Loaded Blister

Gao

et al. 2017

Adv Materials Inter

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“…1(a), which could also effectively avoid stress concentration that is inevitable in probeactivated shear interactions [20,21]. Such bulging devices, also called blister tests, have been widely used to explore mechanical properties of thin films [22,23], interfacial parameters between films and substrates [15,24], and strain-dependent electronic and photonic properties of 2D crystals [25,26]. Figures 1(b) and 1(c) are the optical and scanning electron microscope (SEM) images of a bilayer graphene specimen.…”

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Measuring Interlayer Shear Stress in Bilayer Graphene

et al. 2017

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Monolayer two-dimensional (2D) crystals exhibit a host of intriguing properties, but the most exciting applications may come from stacking them into multilayer structures. Interlayer and interfacial shear interactions could play a crucial role in the performance and reliability of these applications, but little is known about the key parameters controlling shear deformation across the layers and interfaces between 2D materials. Herein, we report the first measurement of the interlayer shear stress of bilayer graphene based on pressurized microscale bubble loading devices. We demonstrate continuous growth of an interlayer shear zone outside the bubble edge and extract an interlayer shear stress of 40 kPa based on a membrane analysis for bilayer graphene bubbles. Meanwhile, a much higher interfacial shear stress of 1.64 MPa was determined for monolayer graphene on a silicon oxide substrate. Our results not only provide insights into the interfacial shear responses of the thinnest structures possible, but also establish an experimental method for characterizing the fundamental interlayer shear properties of the emerging 2D materials for potential applications in multilayer systems.

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“…[7,8]). In this approach, a blister cap is modeled as a thin circular plate where its edge section is assumed to be fully restrained along the periphery by cantilever boundary condition.…”

Section: Thin Platementioning

confidence: 97%

Mechanics of tungsten blistering II: Analytical treatment and fracture mechanical assessment

You

2015

Journal of Nuclear Materials

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Plasma-facing armor Blister Crack J-integral Strain energy release rate a b s t r a c t Since a decade the blistering of pure tungsten under hydrogen implantation has been one of the major research topics in relation to the plasmaewall interaction of tungsten-armored first wall. Overall blistering may reduce the erosion lifetime of the wall. Mature blisters grown by high internal pressure are likely to burst leading to exfoliation of the surface. Therefore, the control and suppression of blistering is an important concern for sustainable operation of the tungsten-armored plasma-facing components. In this context, a quantitative assessment of the mechanical conditions for blister bulging and growth is an important concern.In this article a theoretical framework is presented to describe the bulging deformation of tungsten blisters and to estimate the mechanical driving force of blister growth. The validity of the analytical formulations based on the theory of elastic plates is evaluated with the help of finite element analysis. Plastic strains and J-integral values at the blister boundary edge are assessed by means of numerical simulation. Extensive parametric studies were performed for a range of blister geometry (cap aspect ratio), gas pressure, yield stress and hardening rate. The characteristic features of the blistering mechanics are discussed and the cracking energy is quantitatively estimated for the various combinations of parameters.

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A blister test for interfacial adhesion of large-scale transferred graphene

Cited by 94 publications

References 32 publications

Measuring Graphene Adhesion on Silicon Substrate by Single and Dual Nanoparticle‐Loaded Blister

Measuring Graphene Adhesion on Silicon Substrate by Single and Dual Nanoparticle‐Loaded Blister

Measuring Interlayer Shear Stress in Bilayer Graphene

Mechanics of tungsten blistering II: Analytical treatment and fracture mechanical assessment

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