2018 IEEE International Solid - State Circuits Conference - (ISSCC) 2018
DOI: 10.1109/isscc.2018.8310193
|View full text |Cite
|
Sign up to set email alerts
|

A back-illuminated global-shutter CMOS image sensor with pixel-parallel 14b subthreshold ADC

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
20
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 55 publications
(20 citation statements)
references
References 2 publications
0
20
0
Order By: Relevance
“…The 3D stacking of a sensor layer and processing circuit layer allows us to attain efficient interconnections between the pixels and the columnparallel ADCs and also between the column-parallel ADCs and the processing circuits. Based on the 3D stacking, the major architecture of ADC may change from column parallel to pixel parallel in near future, and actually CISs with pixel-parallel ADCs with excellent performances have been reported [80]. In this paper, however, discussion is focused only on CISs using column-parallel ADCs.…”
Section: Technology Factors Relevant To the Evaluation Of Ciss And Comentioning
confidence: 99%
“…The 3D stacking of a sensor layer and processing circuit layer allows us to attain efficient interconnections between the pixels and the columnparallel ADCs and also between the column-parallel ADCs and the processing circuits. Based on the 3D stacking, the major architecture of ADC may change from column parallel to pixel parallel in near future, and actually CISs with pixel-parallel ADCs with excellent performances have been reported [80]. In this paper, however, discussion is focused only on CISs using column-parallel ADCs.…”
Section: Technology Factors Relevant To the Evaluation Of Ciss And Comentioning
confidence: 99%
“…The pixel-parallel CMOS image sensor has an escalating performance in providing a high frame rate with high-definition resolutions in video systems. This sensor has a signal processor for every pixel, used to process and store the pixel data, and provides a frame rate >10,000 frames/s [ 1 , 2 ]. Though the signal processors’ large footprint bounded the spatial resolution in pixel-parallel design, the 3D stacking architecture allows us to overcome this bottleneck by integrating pixel processors beneath each pixel [ 3 ].…”
Section: Introductionmentioning
confidence: 99%
“…Massively parallel image acquisition in CMOS image sensors [ 1 , 2 , 3 , 4 , 5 ] is frequently based on time-to-digit analog-to-digital converters (ADCs) due to a relatively small silicon area and easy pixel integration. Time-mode ADCs are often used due to their advantages such as low noise (fixed pattern and temporal) and high dynamics.…”
Section: Introductionmentioning
confidence: 99%