A 65-nm CMOS Fully Integrated Transceiver Module for 60-GHz Wireless HD Applications

Siligaris, Alexandre; Richard, Olivier; Martineau, Baudouin; Mounet, C.; Chaix, Fabrice; Ferragut, Romain; Dehos, Cédric; Lanteri, Jérôme; Dussopt, Laurent; Yamamoto, S. D.; Pilard, Romain; Busson, P.; Cathelin, Andreia; Belot, Didier; Vincent, Pierre

doi:10.1109/jssc.2011.2166662

Cited by 154 publications

(40 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A simple QPSK modulation achieves over 120 Gbps throughput on a single waveguide. Other highspeed mm-wave CMOS transceivers for wireless communication have been demonstrated [11], [12]. In the proposed waveguide, the channel response is significantly better than the wireless case.…”

Section: Dielectric Waveguide Designmentioning

confidence: 99%

Dielectric waveguide with planar multi-mode excitation for high data-rate chip-to-chip interconnects

Dolatsha

Arbabian

2013

2013 IEEE International Conference on Ultra-Wideband (ICUWB)

View full text Add to dashboard Cite

An all-electrical, low-cost, wideband chip-to-chip link on a multi-mode dielectric waveguide is proposed. The signal is coupled from the silicon chip to the fundamental and polarization-orthogonal degenerate E x 11 and E y 11 waveguide modes using planar electric and slot dipole antennas, respectively. This approach doubles the capacity of a single line without sacrificing robustness or adding implementation cost and complexity. Two independent ultra-wideband 30GHz channels, each from 90 GHz to 120 GHz, are demonstrated. The large available bandwidth will be channelized in frequency for optimal overall efficiency with a CMOS transceiver. Various design aspects of the structure are examined and discussed. The proposed waveguide offers a solution for Terabit-per-second (Tbps) electrical wireline links.

show abstract

Section: Dielectric Waveguide Designmentioning

confidence: 99%

Dielectric waveguide with planar multi-mode excitation for high data-rate chip-to-chip interconnects

Dolatsha

Arbabian

2013

2013 IEEE International Conference on Ultra-Wideband (ICUWB)

View full text Add to dashboard Cite

show abstract

“…During the past decade, circuit designers have been able to leverage silicon-based CMOS [1,2,3] and BiCMOS [4] technologies performances in order to build MMW transceivers. Now that the IC is well established, new challenges are emerging on the integration of the whole system, including the antenna (achieving the best antenna performance vs. package cost tradeoff is a key concern in order to deliver low cost solution required by high volume consumer markets).…”

Section: Introductionmentioning

confidence: 99%

HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

Pilard

Titz

Gianesello

et al. 2012

Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation

View full text Add to dashboard Cite

During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. So far, HTCC technology has been seen as the chosen one when targeting millimeter wave (MMW) applications. But since 60 GHz applications are targeting large volume consumer applications, the pressure on the cost of the packaging will become higher and it is highly desirable to explore alternative lower cost solutions than HTCC. In this paper, we present 60GHz integrated antennas in an innovative low cost High Density Interconnect (HDI) organic technology demonstrating promising high-gain antenna solution (> 7 dBi).

show abstract

“…Current developments are focused on uncompressed high-definition video transfer indoors between a set-top box and a display, using 1.75 GHz channels in the 60 GHz band. These systems mitigate long channel impulse response by using OFDM modulation and phased arrays [1]- [3]. While effective for indoor high-definition video distribution, they consume relatively high power, making them suitable for wall-plugged devices.…”

Section: Introductionmentioning

confidence: 99%

A 2 Gb/s 5.6 mW Digital LOS/NLOS Equalizer for the 60 GHz Band

Park

Richards

Nikolić

2011

IEEE J. Solid-State Circuits

View full text Add to dashboard Cite

Abstract-The wide unlicensed bandwidth of a 60 GHz channel presents an attractive opportunity for high data rate and low power personal area networks (PANs). The use of single-carrier modulation can yield energy-efficient transmitter and receiver implementation, but equalization of the long channel response in non-line-of-sight (NLOS) conditions presents a significant challenge. A digital equalizer for 60 GHz channels has been designed for both line of sight (LOS) and NLOS channel conditions to meet the IEEE WPAN standard. Power consumption is minimized by using a parallelized distributed arithmetic (DA) architecture. A 2 mm 2 mm test chip in 65nm CMOS implements a 6 tap feedforward and 32 tap feedback equalizer that can be configured to cancel the response of up to 72 symbols, and consumes 5.6 mW at 2 Gb/s throughput. The chip also includes a channel estimator based on a Golay correlator for setting the equalizer coefficients and estimating frequency and timing error.

show abstract

A 65-nm CMOS Fully Integrated Transceiver Module for 60-GHz Wireless HD Applications

Cited by 154 publications

References 16 publications

Dielectric waveguide with planar multi-mode excitation for high data-rate chip-to-chip interconnects

Dielectric waveguide with planar multi-mode excitation for high data-rate chip-to-chip interconnects

HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

A 2 Gb/s 5.6 mW Digital LOS/NLOS Equalizer for the 60 GHz Band

Contact Info

Product

Resources

About