A 60GHz on-chip RF-Interconnect with &amp;#x03BB;/4 coupler for 5Gbps bi-directional communication and multi-drop arbitration

Wu, Hao; Nan, Lan; Tam, Sai-Wang; Hsieh, Hsieh-Hung; Jou, Chewpu; Reinman, Glenn; Cong, Jason; Chang, Mau-Chung Frank

doi:10.1109/cicc.2012.6330666

Cited by 17 publications

(11 citation statements)

References 6 publications

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“…In addition, repeated packet relaying adds latency to communication, and degrades the performance significantly [4]. On-chip transmission lines were previously proposed for point-to-point communications to achieve large bandwidth and low latency [5], [6], and later extended to multipoint-to-multi-point designs [7], [8]. In [5], the baseband data is modulated onto a 7.5-GHz carrier, and the RF communications takes advantage of the wideband characteristics of the interconnect in the LC region of the transmission lines.…”

Section: Introductionmentioning

confidence: 99%

A 25-Gbps 8-ps/mm transmission line based interconnect for on-chip communications in multi-core chips

Huang

2013

2013 IEEE MTT-S International Microwave Symposium Digest (MTT)

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This paper presents a novel on-chip interconnect system for multi-core chips using transmission lines as shared media. It supports both point-to-point and broadcasting communications. Compared to network-on-chip approaches, it offers significant advantages in circuit complexity, energy efficiency and link latency. To demonstrate the scheme, a chip prototype with two 20-mm long transmission lines running in parallel and multiple transmitters/receivers (including 2:1 serializer/1:2 deserializer) was implemented in a 130-nm SiGe BiCMOS technology. The prototype can achieve a date rate of 25.4 Gb/s with an energy efficiency of 1.67 pJ/b in the measurement.

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Section: Introductionmentioning

confidence: 99%

A 25-Gbps 8-ps/mm transmission line based interconnect for on-chip communications in multi-core chips

Huang

2013

2013 IEEE MTT-S International Microwave Symposium Digest (MTT)

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“…According to (2), the reflection coefficient of the transition with the various taper length is calculated compared with the simulated results in Fig. 4.…”

Section: Introductionmentioning

confidence: 99%

“…F UELED by the demand of high data rate and low loss chip-to-chip communication, the interconnect gap have been a challenging issue over decades [1], [2]. Sub-THz/THz interconnect, using the spectrum sandwiched between optical and microwave frequencies, holds high potentials to fill the interconnect gap with wide bandwidth density and high energy efficiency by leveraging advantages of both optical and electrical interconnect approaches: low loss quasi-optical channels as well as advanced high speed semiconductor devices [3].…”

Section: Introductionmentioning

confidence: 99%

Low-loss and Broadband G-Band Dielectric Interconnect for Chip-to-Chip Communication

Wang

et al. 2016

IEEE Microw. Wireless Compon. Lett.

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Abstract-This paper presents a novel dielectric waveguide based G-band interconnect. By using a new transition of microstrip line to dielectric waveguide, the interconnect achieves low insertion loss and wide bandwidth. The measured minimum insertion loss is 4.9 dB with 9.7 GHz 1-dB bandwidth. Besides, the structure is based on standard micromachined processing and easy to integrate with conventional packaging.

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“…Besides, the interference between channels is a big issue for wireless based schemes. Chang's group [11] demonstrates a design on wired interconnect based on-chip transmission line, which also faces the challenge of increasingly high losses versus frequencies.…”

Section: Introductionmentioning

confidence: 99%

“…Interconnect research has been active in two areas: optical interconnect [3]- [6] and electrical interconnect [7]- [11]. Optical interconnects have the advantages of low loss and high bandwidth, but it is still very challenging to integrate highly efficient light sources with current CMOS processes [4].…”

Section: Introductionmentioning

confidence: 99%

High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits

Wang

et al. 2016

IEEE Trans. Microwave Theory Techn.

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Abstract-This paper presents for the first time the design, fabrication, and demonstration of micromachined silicon dielectric waveguide based sub-THz interconnect channel for high efficiency, low cost sub-THz interconnect, aiming to solve the longstanding intra-/inter-chip interconnect problem. Careful studies of the loss mechanisms in the proposed sub-THz interconnect channel are carried out to optimize the design. Both theoretical and experimental results are provided with good agreement. To guide the channel design, a new Figure-of-Merit is also defined. The insertion loss of this first prototype with a 6-mm long interconnect channel is about 8.4 dB at 209.7 GHz, with a 3-dB bandwidth of 12.6 GHz.

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A 60GHz on-chip RF-Interconnect with λ/4 coupler for 5Gbps bi-directional communication and multi-drop arbitration

Cited by 17 publications

References 6 publications

A 25-Gbps 8-ps/mm transmission line based interconnect for on-chip communications in multi-core chips

A 25-Gbps 8-ps/mm transmission line based interconnect for on-chip communications in multi-core chips

Low-loss and Broadband G-Band Dielectric Interconnect for Chip-to-Chip Communication

High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits

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