2022
DOI: 10.1109/jlt.2021.3133668
|View full text |Cite
|
Sign up to set email alerts
|

A 37-Gb/s Monolithically Integrated Electro-Optical Transmitter in a Silicon Photonics 250-nm BiCMOS Process

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
2
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 7 publications
(3 citation statements)
references
References 13 publications
0
2
0
Order By: Relevance
“…Monolithic integration of optical lasers and gain has been a goal in the silicon photonics industry for the past ten years. 102 The achievement of this goal is a constraint with distinct problems, namely: (a) variation in the coefficients of thermal expansion increases to strain cracking and fault migration throughout cooldown; (b) a Si substrate was used to synthesize a polar compound with anti-phase domains. 103 The first constraints can be mainly overcome by better templates and greater containment in the separate heterostructure of the containment (SCH), which in the past lowered the overall epitaxial thickness from 8 μm to merely 4 μm.…”
Section: Future Perspectivementioning
confidence: 99%
“…Monolithic integration of optical lasers and gain has been a goal in the silicon photonics industry for the past ten years. 102 The achievement of this goal is a constraint with distinct problems, namely: (a) variation in the coefficients of thermal expansion increases to strain cracking and fault migration throughout cooldown; (b) a Si substrate was used to synthesize a polar compound with anti-phase domains. 103 The first constraints can be mainly overcome by better templates and greater containment in the separate heterostructure of the containment (SCH), which in the past lowered the overall epitaxial thickness from 8 μm to merely 4 μm.…”
Section: Future Perspectivementioning
confidence: 99%
“…It has been considered to be the most promising technology to deal with the ever-increasing network traffic [1][2][3]. Various integrated photonic devices or systems have been developed and optimized in recent years, such as silicon photonics switches [4], electro-optical modulators [5][6][7], photodetectors [8][9][10] and silicon photonic transceivers [11][12][13][14][15][16][17]. For real-world applications, optical interconnections between fibers and silicon photonic chips are crucial as high fiber-tochip coupling loss limits the performance of optical communication systems.…”
Section: ⅰ Introductionmentioning
confidence: 99%
“…Due to their low optical bandwidth, both the EAMs and the ring modulators are sensitive to process and temperature variations and exhibit chirping [13] [14]. Silicon or lithium niobate MZMs compensate these drawbacks, however at the cost of a large chip footprint or high requirements regarding the output voltage swing of the driver [15].…”
Section: Introductionmentioning
confidence: 99%