2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013
DOI: 10.1109/isscc.2013.6487765
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A 33.6-to-46.2GHz 32nm CMOS VCO with 177.5dBc/Hz minimum noise FOM using inductor splitting for tuning extension

Abstract: Signal processing in ultra-wide bandwidths is one of the key challenges in the design of multi-Gb/s wireless transceivers at mm-Waves, where channels covering 57GHz to 66GHz are specified. Further considering spreads due to process variations and the stringent reference phase noise to ensure signal integrity calls for an ultra-wide tuning range and low-noise on-chip oscillator. Meeting this target is even more challenging when adopting an ultra-scaled CMOS technology node where key passive components suffer fr… Show more

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Cited by 46 publications
(13 citation statements)
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“…Table summarizes and compares the performance capabilities of the VCO with those of reported VCOs. The FOM T value of the VCO is –191.3 dBc/Hz, which is the highest FOM T among the CMOS VCOs …”
Section: Measurement Resultsmentioning
confidence: 89%
“…Table summarizes and compares the performance capabilities of the VCO with those of reported VCOs. The FOM T value of the VCO is –191.3 dBc/Hz, which is the highest FOM T among the CMOS VCOs …”
Section: Measurement Resultsmentioning
confidence: 89%
“…The stringent trade-off between quality factor and tuning range of mm-wave oscillators dictates a low tuning range for a high FOM VCO. Various techniques exploiting alternative tuning approaches have been proposed to set a compromise between tuning range and FOM [7], [8].…”
Section: Introductionmentioning
confidence: 99%
“…The mm-wave frequency range, nominally located between 30GHz and 300GHz is of great interest in this framework [2]- [3]. The spectrum is very broad and still unpopulated, allowing allocating bandwidths several GHz wide, leading to multi-Gbps communication speed even with very simple modulation techniques [4]- [6]. Moreover, with a wavelength of less than 10mm, the size of the antenna turns out to be very compact, fitting into the IC package or the chassis of small devices, allowing miniaturization with respect to current wired solutions [7].…”
Section: Introductionmentioning
confidence: 99%