“…This results in different requirements, but their implementation is similar: the capabilities have not (yet) been integrated into a single module, and are implemented by duplicating RF paths, leading to component duplication [57]. In 2009, convergence of standards was achieved by assembling dedicated ICs on PCBs, though system-on-chip (SoC) solutions (integrating multiple RF frontends and modems on the same chip) had also appeared [55]. Now, in popular modern smartphones, a SoC connected to PAs, SAW/BAW/FBAR duplexers or filters, LNAs and switches, often in modules (or 'banks') are observed.…”