2004
DOI: 10.1109/jlt.2004.833263
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A 2.5-mW SOS CMOS Optical Receiver for Chip-to-Chip Interconnect

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Cited by 12 publications
(2 citation statements)
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“…The transparency of the sapphire substrate enables simple flip-chip integration of optoelectronic devices such as photodetectors and vertical cavity surface emitting lasers (VCSEL). Optical signals can couple and transmit through the die with little loss [4,5]. The primary benefits of the SOS technology for our receiver design are the reduced parasitic capacitance of the input devices and the inductors.…”
Section: Receiver Architecturementioning
confidence: 99%
“…The transparency of the sapphire substrate enables simple flip-chip integration of optoelectronic devices such as photodetectors and vertical cavity surface emitting lasers (VCSEL). Optical signals can couple and transmit through the die with little loss [4,5]. The primary benefits of the SOS technology for our receiver design are the reduced parasitic capacitance of the input devices and the inductors.…”
Section: Receiver Architecturementioning
confidence: 99%
“…The weakness of this design is in the conversion from differential to single ended signaling as power is wasted in the dummy load. Figure 2 shows an electrical model for a conventional receiver [1]. In this case, the conversion from a single ended optical signal to a differential electronic signal happens at the output of the transimpedance amplifer (TIA) where a fixed voltage is applied to the second input of the differential amplifier.…”
Section: Introductionmentioning
confidence: 99%