A 122 GHz On-Chip 3-Element Patch Antenna Array with 10 GHz Bandwidth

Lammert, Vincent; Hamouda, Mohamed; Weigel, Robert; Issakov, Vadim

doi:10.23919/eumc48046.2021.9337954

Cited by 10 publications

(3 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When the cross-sectional area of each unit is larger, the resistance value will be smaller, and the transmission loss will also be smaller. In the design of the patch antenna, this characteristic is used to design the antenna with the main beam direction facing upward and then make the reflective surface through the back metal to enhance the antenna gain [54].…”

Section: Microstrip Line Antenna Structurementioning

confidence: 99%

Near Field Sensing Applications with Tunable Beam Millimeter Wave Antenna Sensors in an All-in-One Chip Design

Chung

Lin

2022

Electronics

View full text Add to dashboard Cite

In this paper, a single-band beam control antenna is designed with a parallel coupler to realize a microstrip patch antenna passive wireless sensor in the form of a chip. It has a phase shift characteristic of the antenna radiation direction in the positive and negative directions. The antenna includes an orthogonal direction coupler design with a 90° parallel coupler in phase using a special structure that allows the whole chip area to be miniaturized while allowing the main beam angle to have a directivity function. The coupler is designed for the 28 GHz millimeter wave band. After feeding the patch antenna at the output port of the coupler and simultaneously feeding the excitation at the input port, the beam phase changes to +45° and +135° with a phase difference of 90°. The designed antenna size is 1160 μm × 790 m, and the overall IC size is 1.2 mm × 1.2 mm. The power density simulation shows that the maximum power density is only 0.00797 W/kg for a 1 human sampling area, which means that the antenna sensor is suitable for use on human surfaces.

show abstract

Section: Microstrip Line Antenna Structurementioning

confidence: 99%

Near Field Sensing Applications with Tunable Beam Millimeter Wave Antenna Sensors in an All-in-One Chip Design

Chung

Lin

2022

Electronics

View full text Add to dashboard Cite

show abstract

“…A key component of the system's performance is the design and integration of antennas on-chip. However, a bulky antenna has to be integrated into the expensive IC area, while offering poor radiation efficiency and, thus, low antenna gain due to the chips's naturally low substrate height in the BEOL stackup of the IC processes [14], [15]. This low antenna gain can be compensated for using dielectric lenses, or localized backside etching [1], [7], [16].…”

Section: Introductionmentioning

confidence: 99%

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

View full text Add to dashboard Cite

This paper presents a broadband low-loss fanin wafer level ball grid array (WLB) vertical through-moldvia (TMV) interconnect that enables highly integrated systemin-package (SiP) applications beyond 220 GHz. The dedicate advantage of the proposed approach is to further minimize the separation between package components (e.g., antenna in package (AiP)) and on-chip receiver or transmitter chain. To demonstrate the robustness of the TMV interconnect design, the necessity for co-simulation of the integrated circuit (IC) package and the IC itself during the package-design is shown. Therefore, an in-depth analysis of the suppression of parasitic mode oscillation inside silicon is carried out. Furthermore, the parasitic radiation loss at the TMV interconnect discontinuity is given and a verification of the proposed TMV due to high agreement of simulation and measurement results is demonstrated. The interconnect has been verified with a measured 10 dB return loss bandwidth of 38 GHz and a de-embedded insertion loss of less than 2.8 dB at 275 GHz, which enables a compact low-loss broadband signal transition from active IC components in the backend-of-line (BEOL) to passive components in package. Compared to fan-out WLB, the developed fanin WLB solution enables higher integration density of active and passive components with the shortest interconnects for minimal insertion loss. Thus, the proposed fan-in TMV packaging provides a very compact, easy-to-assemble and cost-efficient alternative for SiP designs for future broadband communication and sensing solutions.

show abstract

“…As an example, the application for radio science experiments is presented in [ 14 ], whereas an example for 5G applications is reported in [ 15 ] for the C-band case using a uniform linear array (ULA) configuration with a pre-assigned element distance. Reference [ 16 ] presents the design and measurements of a 122 GHz on-chip patch antenna array in a 130 nm SiGe BiCMOS technology. The array is formed by three rectangular patches in the top metallization layer, with the ground plane in the lowest layer.…”

Section: Introductionmentioning

confidence: 99%

A Flexible Design Strategy for Three-Element Non-Uniform Linear Arrays

Quirini

Filippini

Bongioanni

et al. 2023

Sensors

View full text Add to dashboard Cite

This paper illustrates a flexible design strategy for a three-element non-uniform linear array (NULA) aimed at estimating the direction of arrival (DoA) of a source of interest. Thanks to the spatial diversity resulting from non-uniform sensor spacings, satisfactory DoA estimation accuracies can be achieved by employing a very limited number of receiving elements. This makes NULA configurations particularly attractive for low-cost passive location applications. To estimate the DoA of the source of interest, we resort to the maximum likelihood estimator, and the proposed design strategy is obtained by constraining the maximum pairwise error probability to control the errors occurring due to outliers. In fact, it is well known that the accuracy of the maximum likelihood estimator is often degraded by outliers, especially when the signal-to-noise power ratio does not belong to the so-called asymptotic region. The imposed constraint allows for the defining of an admissible region in which the array should be selected. This region can be further modified to incorporate practical design constraints concerning the antenna element size and the positioning accuracy. The best admissible array is then compared to the one obtained with a conventional NULA design approach, where only antenna spacings multiple of λ/2 are considered, showing improved performance, which is also confirmed by the experimental results.

show abstract

A 122 GHz On-Chip 3-Element Patch Antenna Array with 10 GHz Bandwidth

Cited by 10 publications

References 8 publications

Near Field Sensing Applications with Tunable Beam Millimeter Wave Antenna Sensors in an All-in-One Chip Design

Near Field Sensing Applications with Tunable Beam Millimeter Wave Antenna Sensors in an All-in-One Chip Design

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

A Flexible Design Strategy for Three-Element Non-Uniform Linear Arrays

Contact Info

Product

Resources

About