A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping

Miura, Noriyuki; Ishikuro, Hiroki; Sakurai, Takayasu; Kuroda, Tadahiro

doi:10.1109/isscc.2007.373442

Cited by 83 publications

(74 citation statements)

References 15 publications

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“…• 8 Gbps of data at maximum can be transferred with low energy dissipation (0.14 pJ / bit) and low bit-error rate (BER< 10 −12 ) [7] • The number of chips which can be stacked is not limited by TCI but a physical environment.…”

Section: Inductive Coupling Channelsmentioning

confidence: 99%

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Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface

Nomura

Matsushita

Kadomoto

et al. 2018

IJNC

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A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, we have developed intellectual properties (IPs), and proposed an interconnection network which can make the use of IPs. We also developed a real chip embedded the IP, and evaluated the performance. By stacking multiple chips with the proposed IP, an inter-chip network with link-to-link flow control by piggyback control is established. The new proposed escalator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control was less than 3%-4% of that without control messages.

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Section: Inductive Coupling Channelsmentioning

confidence: 99%

“…Wireless interconnections are classified into capacitive coupling [4] and inductive coupling [5,6,7]. Since the use of capacitive coupling is limited to face-to-face stacking of two chips, inductive coupling which can interconnect more than two chips has been mainstream of wireless chip stacking.…”

Section: Introductionmentioning

confidence: 99%

Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface

Nomura

Matsushita

Kadomoto

et al. 2018

IJNC

Self Cite

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“…The driver and inductor pair for sending data is called the TX channel, while the receiver and inductor pair is called the RX channel. Data can be transferred at most 8Gbps with a low energy dissipation (0.14pJ per bit) and a low bit-error rate (BER< 10 −12 ) [8]. Data multicast can be used if a TX channel is placed at the same location of multiple RX channels in different chips.…”

Section: Inductive Coupling Through Chip Interfacementioning

confidence: 99%

“…The paper [4], [8] show the detail. TSV can transfer data at most 10Gbps with the 0.6pJ/bit [9], while the TCI can do at most 8Gbps with the 0.14pJ/bit.…”

Section: Inductive Coupling Through Chip Interfacementioning

confidence: 99%

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Novel Chip Stacking Methods to Extend Both Horizontally and Vertically for Many-Core Architectures with ThrouChip Interface

Nakahara

Ozaki

Matsutani

et al. 2016

IEICE Trans. Inf. & Syst.

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SUMMARYThe increase of recent non-recurrent engineering cost (design, mask and test cost) have made large System-on-Chip (SoC) difficult to develop especially with advanced technology. We radically explore an approach for cheap and flexible chip stacking by using Inductive coupling ThruChip Interface (TCI). In order to connect a large number of small chips for building a large scale system, novel chip stacking methods called the linear stacking and staggered stacking are proposed. They enable the system to be extended to x or/and y dimensions, not only to z dimension. Here, a novel chip staking layout, and its deadlock-free routing design for the case using single-core chips and multi-core chips are shown. The network with 256 nodes formed by the proposed stacking improves the latency of 2D mesh by 13.8% and the performance of NAS Parallel Benchmarks by 5.4% on average compared to that of 2D mesh. key words: inductive coupling interconnect, interconnection network, network on chip

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Capacitive Coupled Communication

Hopkins

Chow

Liu

et al. 2010

Integrated Circuits and Systems

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A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping

Cited by 83 publications

References 15 publications

Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface

Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface

Novel Chip Stacking Methods to Extend Both Horizontally and Vertically for Many-Core Architectures with ThrouChip Interface

Capacitive Coupled Communication

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