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Microstructure evolution in Fe-based-aluminide metallic–intermetallic laminate (MIL) composites

“…It is reasonable to expect that if the exponent value of a compound layer is between 0.5 and 1 that interface reactions, as well as diffusion, both contribute to the rate controlling processes. This mixed rate-controlling process was seen in the reactive diffusion of Al-Cu [20], Al-Ni [21] and Fe-Al [22] binary system, where more than one intermetallic phase will grow during the interdiffusion reaction creating a stack of laminate reactive layers. Although the growth of each independent layer strictly follows one standard growth mechanism, the total layer thickness will show a mixed rate-controlled process.…”

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

“…The overall change in thickness of the layer is therefore the difference between the rate of growth of the layer and the rate of its dissolution [36]. The rate of dissolution is described by the following equation [44,45]:…”

Interfacial interaction of solid nickel with liquid bismuth and Bi–base alloys

“…For example, at 350 • C c s is 0.39% for Bi and 0.015% for the alloy, while k is 4.0 × 10 −5 m s −1 for the former and 3.8 × 10 −5 m s −1 for the latter. This appears to be a general trend in the dissolution of transition metals and their alloys in liquid-metal melts [1,5]. It means that, in spite of the great difference in solubility values, the rates, with which those are attained, are not so different.…”