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Watanabe, Hirozumi; Abe, Shinji; Honma, Hideo

doi:10.1023/a:1003273329474

Cited by 11 publications

(7 citation statements)

References 4 publications

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“…Electroless gold is frequently used in wirebonding applications as a suitable finish for mounting chips to chip carriers. The bonding pad metal should be of high purity and homogeneity for optimum performance. − Gold is a choice metal for this purpose because it is highly resistant to corrosion and oxide formation, is soft enough for optimal thermosonic wirebond processing, and is capable of withstanding mechanical stresses. − A commonly used electroless gold bath employs KAuCN 2 as a gold source, KCN as stabilizer, and dimethylamine borane (DMAB) as a reducing agent in a suitable alkaline media (pH 13−14) . Plating rates obtained with this bath are typically 1−3 μm/h …”

Section: Introductionmentioning

confidence: 99%

Impedance and Morphological Properties of Electroless Gold on Industrial Metal Coupons

and

Sadik

2001

Langmuir

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An approach for correlating the bath chemistry during electroless gold deposition with the overall plating quality on industrial wirebond samples is presented. Electrochemical impedance spectroscopy of the reducing agent dimethylamine borane (DMAB) on gold in alkaline solution was used to provide qualitative information on the interfacial adsorption/desorption processes occurring during deposition. Depending on hydroxide and DMAB concentration, impedance data obtained under hydrodynamic conditions at the gold oxide reduction potential (0.184 V vs Ag/AgCl) follow two different equivalent circuit models that do not exhibit contribution from diffusion. Gold deposit quality was assessed with scanning electron microscopy and energy-dispersive spectrometry under a variety of bath compositions. Finally, bath efficiency was evaluated in terms of plating rate obtained from X-ray fluorescence data. The substrate surface/solution interactions are linked to the final quality of the resulting gold layer. This work shows that substrate incompatibility and the ratio imbalance between gold and the reducing agent concentrations produce thin, dull deposits. Maintaining the optimum ratio of DMAB/KOH provides balance in the bath chemistry necessary for efficient plating.

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Section: Introductionmentioning

confidence: 99%

Impedance and Morphological Properties of Electroless Gold on Industrial Metal Coupons

and

Sadik

2001

Langmuir

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“…Interestingly, when glucose was used as the reducing agent, large ultrathin nanosheets were produced (Figure S27c). These results can be attributed to the weak reducing effects of DMAB and glucose [30] compared to the strong reduction capacities of NaBH 4 and SA. The slow reduction of the DNA-bound Au species by DMAB is crucial for prevent the preformed nanoflakes from aggregating into large nanoparticles and blocky products.…”

Section: Angewandte Chemiementioning

confidence: 96%

DNA Framework‐Templated Fabrication of Ultrathin Electroactive Gold Nanosheets

Li,

Ding,

Xie

et al. 2024

Angew Chem Int Ed

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Generally, two‐dimensional gold nanomaterials have unique properties and functions that offer exciting application prospects. However, the crystal phases of these materials tend to be limited to the thermodynamically stable crystal structure. Herein, we report a DNA framework‐templated approach for the ambient aqueous synthesis of freestanding and microscale amorphous gold nanosheets with ultrathin sub‐nanometer thickness. We observe that extended single‐stranded DNA on DNA nanosheets can induce site‐specific metallization and enable precise modification of the metalized nanostructures at predefined positions. More importantly, the as‐prepared gold nanosheets can serve as an electrocatalyst for glucose oxidase‐catalyzed aerobic oxidation, exhibiting enhanced electrocatalytic activity (~ 3‐fold) relative to discrete gold nanoclusters owing to a larger electrochemical active area and wider band gap. The proposed DNA framework‐templated metallization strategy is expected to be applicable in a broad range of fields, from catalysis to new energy materials.

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“…183 They also studied the wetting behaviour between solder and electroless nickel deposits. 184 Watanabe et al 185 investigated Au wire bondability of electroless gold plating using disulphiteaurate complex. Thus it can be clearly seen that the solderability of electroless alloy deposits has made considerable progress in these 20 years.…”

Section: Studying Nature Of Electroless Platingmentioning

confidence: 99%