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Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

“…This correlation is consistent with the results from this study. In this experiment, the addition of In increases the wetting force, and it has been well known that In can decrease the surface tension [14]. Therefore, the addition of In improves the wettability of Sn-0.3Ag-0.7Cu solder alloy by decreasing the contact angle.…”

Surface and transport properties of Au–In liquid alloys

“…Many authors reported surface tension reference data on indium [36][37][38][39][40][41][42][43][44][45][46][47] (Fig. 5).…”

“…5). Due to its high affinity for oxygen, the surface tension data on In show a considerable scatter, exhibiting an error of about ±2.32% (±20 mN/m) around the reported mean value [24,[45][46][47]. The surface tension data on In obtained by the maximum bubble pressure [42] seems to be too low with respect to the mean value (±8.5%), and thus these data did not taken into account.…”

Formation Procedure and Microstructural Analysis of Pb7Bi3 (Pb–Bi) Alloy Nanowires

“…In this experiment, is 416.67 dyne/cm, 24) is 105.8 , the radius of the nanochannel within the anodic alumina template is 80 nm and the total sample area, A, is 1 cm 2 . The sample weight is 0.01 kg and R is 0.02 m. Therefore, the critical centrifugal force is 574.9 N and the critical rotation rate is 16,190 rpm.…”