Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

“…Thus, many research groups are concerned with the development of new lead-free solders and their composites. Up to now, several types of binary and ternary Sn-based Pb-free solder systems have been discussed in the literature including Sn-Bi, Sn-Zn, Sn-Zn-Bi, Sn-Ag, Sn-Ag-Zn, Sn-Zn-In, Sn-Bi-Ag and Sn-Ag-Cu [5][6][7]. Among the numerous lead-free solders, ternary Sn-Ag-Cu solder alloys, with near eutectic compositions and melting temperatures of around 217 • C, are regarded as promising candidates to replace the traditional Sn-Pb solder for application in the electronic packaging industry [8,9].…”

Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

“…These tribological behaviors and the hardening effects are consistent with previous reports [26][27][28] that discussed the correlation between surface micro-hardness and the surface frictional property. Because the mechanical properties and the melting temperature of solder alloy are highly dependent on the microstructure and the composition of the solder alloy, [29][30][31] these results suggest that the degradation of the bath has a negative inuence on the fabrication of solder bumps. The formation of nanoparticles on the Sn-Ag solder bumps therefore may be one of the major causes of the collapse of the solder bumps during the solder reow shown in Fig.…”

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

“…For the Sn-Ag/Cu couple, the interfacial IMC layer consists of Cu 6 Sn 5 and Cu 3 Sn binary compounds and these layer were generated during the soldering process and grew in the high temperature environment [4]. Many studies have been done to further improve the solder properties in order to reduce the IMC growth by adding extra element such as In, Bi, and Zn into the solder alloys [5][6][7][8]. Recently, nano-composite solders have been developed due to rapidly changes in technologies and moving towards miniaturized of consumer electronic products including the size of electronic components.…”