Untitled

The effect of additives on the pulsed electrodeposition of copper

“…The hardness of the copper deposit is found to increase with increase of duty cycle. 37 A maximum hardness value is obtained at 80% duty cycle at low frequencies (10 and 25 Hz) and at 40% duty cycle at high frequencies (75 and 100 Hz) at constant current density of current density of 2 A dm 22 . Because in a low pulse duty cycle a higher peak current is passed, this produces powdery or burnt deposits with poor adhesion and considerable porosity.…”

“…At higher duty cycles the effect is pronounced and hence lower current density is observed. Maximum increase in current efficiency has been observed at 80% duty cycle for the low frequency pulse plating and at 40% duty cycle for the high frequency pulse plating at the average current density of 2 A dm 22 . Increase in current efficiency must be due to the preferential reduction of an adsorbed monolayer of Cu 2z with pulses of charges equivalent to the reduction of this monolayer.…”

“…84 SG H 2 SO 4 with polyethylene glycol and the di-sodium salt of ethylenediamine tetraacetic acid (EDTA) as additives was prepared and purified by charcoal treatment and dummying at 0 . 5 A dm 22 . Deposition of copper was on copper cathodes (20 cm 2 area).…”

“…10 Intensive studies were carried out on pulse electrodeposition of copper from various acid and alkaline baths with and without additives and the effect of pulse parameters on the structural properties of the copper deposits has been studied in detail. [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28] Whereas much work has been carried out on the effect of various organic additives on the properties of copper deposits formed by DC electrodeposition, [29][30][31][32][33][34][35] very few data are available concerning the role of organic additives on pulsed electrodeposition and on the properties of electrodeposits. 36 In the present study, a systematic investigation of copper deposition from an acid copper sulphate bath has been undertaken with the application of square wave pulse current.…”

Factors influencing the interfacial width of copper gradients on gold produced by spatiotemporal control of the in-plane electrochemical potential distribution: electrode geometry and plating solution composition

“…An extensive amount of work has appeared in the literature examining the effect of plating solution modifiers on the physical and chemical characteristics of electrochemically deposited Cu films [25][26][27][28][29][30][31][32][33][34][35]. Depositing Cu films with the in-plane potential gradient technique extends the information obtained from a typical deposition experiment by offering the unique possibility of examining not only the morphology of the film as a whole but also that of the resulting CujAu interfacial region.…”