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Kang, Kweon Ho; Song, Kiwon; Yang, Mino

doi:10.1023/a:1026111420323

Cited by 8 publications

(6 citation statements)

References 10 publications

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“…2. The linear thermal expansion of a reference simulated fuel with an equivalent burnup of 35,000 MWd/tU reported by Kang et al [17] is also shown in Fig. 2 for the purpose of comparison.…”

Section: Resultsmentioning

confidence: 91%

Thermal Expansion of a Simulated Fuel with Fission Products Forming Solid Solutions

et al. 2006

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Thermal expansions of UO 2 and a simulated fuel with fission products forming a solid solution were studied using a dilatometer in the temperature range from 298 to 1800 K. The densities of the UO 2 and the simulated fuel used in the measurements were 10.43 g · cm −3 (95.2% of theoretical density (TD)) and 10.35 g · cm −3 (95.6% of TD), respectively. The linear thermal expansion of the simulated fuel is higher than that of UO 2 , and the difference between this fuel and UO 2 increases monotonically with temperature. The average linear thermal expansion coefficients of UO 2 and the simulated fuel are 1.09 × 10 −5 and 1.23 × 10 −5 K −1 , respectively. As the temperature increases to 1800 K, the relative densities of UO 2 and the simulated fuel decrease to 95.1 and 94.7% of their initial densities at 298 K.

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“…2. The linear thermal expansion of a reference simulated fuel with an equivalent burnup of 35,000 MWd/tU reported by Kang et al [17] is also shown in Fig. 2 for the purpose of comparison.…”

Section: Resultsmentioning

confidence: 91%

Thermal Expansion of a Simulated Fuel with Fission Products Forming Solid Solutions

et al. 2006

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“…The columnar sample size was 10 Â Ф5 mm, and at least 3 samples were prepared for testing. The linear expansion was calculated according to Equation 3 [30] :…”

Section: Electrical and Thermal Properties Analysismentioning

confidence: 99%

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Wang

Guo

et al. 2017

Adv Eng Mater

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In this paper, the authors propose a highly conductive die attach material based on Ag@Sn powder for power devices operating at high temperatures or in other harsh environments. The preform can be reflowed at 250 C (18 C above the T m of Sn, 232 C), but the resulting bondline can sustain high temperatures up to 400 C with a high shear strength due to the high re-melting temperature of the formed Ag 3 Sn (T m ¼ 480 C) after the complete consumption of the outer Sn layers. In addition, the formed bondline exhibits excellent electrical and thermal conductivities due to the embedded Ag particles in the interconnections. The interconnections also exhibit excellent reliability under thermal shock cycling from À55 to 200 C because of the increased bondline thickness and inherent ductility of the Ag particles embedded in the Ag 3 Sn.

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“…The thermal expansions of the samples were measured in the axial direction with a linear variable differential transformer (LVDT) transducer over a temperature range of room temperature to 150 • C by a push-rod-type dilatometer (DIL 402C, Netzsch) [9]. The measurements were carried out with a constant heating rate of 5 K · min −1 in vacuum.…”

Section: Measurement Of Thermal Expansionmentioning

confidence: 99%

“…To investigate whether this instability is the inherent property of the alloy or caused by the errors introduced by the triple measurements of thermal diffusivity, specific heat, and density, the thermal conductivity must be measured directly. The linear thermal expansion which represents the ratio of the length change to the initial length can be calculated using the following expression [9]:…”

Section: Fig 2 Experimental Thermal Diffusivity Of Sn-ag-cu Alloy Samentioning

confidence: 99%

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Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

et al. 2009

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Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 • C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 • C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal

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Untitled

Cited by 8 publications

References 10 publications

Thermal Expansion of a Simulated Fuel with Fission Products Forming Solid Solutions

Thermal Expansion of a Simulated Fuel with Fission Products Forming Solid Solutions

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

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