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Efremov, A. M.; Svettsov, V. I.

doi:10.1023/a:1015463004089

Cited by 14 publications

(11 citation statements)

References 11 publications

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“…The modeling of the kinetics of neutral species in the plasmas of HCl mixtures with Ar, H 2 , O 2 , and Cl 2 using the kinetic schemes (sets of reactions, cross sec tions, and rate constants) reported in [5][6][7][8] showed that the assumption γ Cl , γ H = const does not ensure agreement between the patterns of the n H, Cl = f(y) and = f(y) curves (Fig. 2).…”

Section: Resultsmentioning

confidence: 99%

“…The plasma was simulated using the joint solution of the stationary Boltzmann equation, the plasma conductivity equation, and equations of chemical kinetics for neutral and charged species. The algo rithm of the simulation is detailed elsewhere [3,7,8]. The E/N value maintaining steady state plasma was determined by equality of the electron formation and decay rates in the effective diffusion coefficient approximation.…”

Section: A M Efremov and D B Murinmentioning

confidence: 99%

“…The kinetic schemes (sets of reactions, cross sec tions, and rate constants) used in the calculations were borrowed from [5][6][7][8]. The validity of the models was supported by satisfactory agreement between the experimental and calculated values of E/N.…”

Section: A M Efremov and D B Murinmentioning

confidence: 99%

“…In previous studies [5][6][7][8] devoted to the simulation of plasmas of binary mixtures of HCl with Ar, H 2 , O 2 , and Cl 2 , it was shown that varying the initial composition of the mixture at constant external discharge parameters affects the kinetics of plasma chemical processes by changing the electron energy distribution in plasma and the mean energy and num ber density of the electrons. The main drawback of the aforementioned studies was a weak experimental basis, which could not allow an unambiguous conclu sion about the reliability of the data on the plasma composition.…”

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confidence: 99%

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Kinetics of heterogeneous decay of chlorine and hydrogen atoms in plasmas of HCl binary mixtures with Ar, H2, O2, and Cl2

Efremov

Murin

2015

High Energy Chem

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The heterogeneous decay kinetics of chlorine and hydrogen atoms in plasmas of HCl mixtures with Ar, H 2 , O 2 , and Cl 2 of variable initial composition have been studied using optical and spectral diagnos tics methods and plasma simulation. It has been shown that the assumption about the constant recombina tion probability is inconsistent with the behavior of calculated concentrations of atoms depending on their reduced emission intensity. Mechanisms for the effect of the initial composition of the mixtures on the recombination probability have been proposed.

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Section: Resultsmentioning

confidence: 99%

Section: A M Efremov and D B Murinmentioning

confidence: 99%

Section: A M Efremov and D B Murinmentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

Kinetics of heterogeneous decay of chlorine and hydrogen atoms in plasmas of HCl binary mixtures with Ar, H2, O2, and Cl2

Efremov

Murin

2015

High Energy Chem

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“…[1][2][3] There have been many studies on plasma etching of Cu. [4][5][6][7] These studies focused on how to vaporize the nonvolatile reaction product generated in the plasma process, e.g., by applying extra energy in the form of ultraviolet, infrared, or heat. 4,7 Kuo and Lee reported a new plasma-based Cu etching method using a conventional parallelplate reactor with Cl 2 or Br 2 containing feed gas.…”

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Additive-Gas Effects on Cl[sub 2] Plasma-Based Copper-Etch Process and Sidewall Attack

Liu

Kuo

2008

J. Electrochem. Soc.

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The influence of the additive gas in Cl 2 plasma-based copper etch and sidewall attack was investigated. The additive gas, such as Ar, N 2 , and CF 4 , drastically changed the plasma-phase chemistry, i.e., the Cl radical concentration, and the ion-bombardment energy, which resulted in changes of the copper chlorination rate and the sidewall roughness. The addition of Ar increased the Cl concentration, which increased the copper chlorination rate and the sidewall attack. The addition of N 2 enhanced ion bombardment, which increased the copper chlorination rate. Meanwhile, the addition of N 2 diluted the Cl concentration and formed a copper nitride passivation layer, which protected the sidewall and reduced roughness. The addition of CF 4 induced a fluorocarbon passivation layer, which decreased the copper chlorination rate in the vertical direction but protected the sidewall from vigorous Cl attack and resulted in a smooth sidewall surface. Therefore, the additive gas not only affected the Cu chlorination rate but also influenced sidewall roughness.

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Experimental investigation of anodized/ spray pyrolysed nanoporous structure on heat transfer augmentation

et al. 2009

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This paper analyzes the effects of nanoporous surface on heat transfer temperaments of assorted thermal conducting materials. A phenomenal proposal of wielding the surface roughness to ameliorate the heat transfer rate has been discovered. The maximum increase of heat transfer rate procured by nanoporous layers is 133.3% higher than the polished bare metals of surface roughness 0.2 μm. This plays an imperative role in designing compact refrigeration systems, chemical and thermal power plants. Experimental results picture a formidable upswing of 58.3% heat transfer in chemically etched metals of surface roughness 3 μm, 133.3% in nanoporous surface of porosity 75−95 nm formed by electrochemical anodization, and porosity of 40−50 nm formed by spray pyrolysis increases the heat transfer by 130%. Effects of porosity, flow velocity and scaling on the energy transfer are also scrutinized. This paper also analyzes the multifarious modes of nanoporous fabrication, to contrive both prodigious and provident system.

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Cited by 14 publications

References 11 publications

Kinetics of heterogeneous decay of chlorine and hydrogen atoms in plasmas of HCl binary mixtures with Ar, H2, O2, and Cl2

Kinetics of heterogeneous decay of chlorine and hydrogen atoms in plasmas of HCl binary mixtures with Ar, H2, O2, and Cl2

Additive-Gas Effects on Cl[sub 2] Plasma-Based Copper-Etch Process and Sidewall Attack

Experimental investigation of anodized/ spray pyrolysed nanoporous structure on heat transfer augmentation

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