7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package with Laser Assisted Bonding and Mass Reflow Technology

Hsu, Ian C.; Chen, Chi-Yuan; Lin, Stanley; Yu, Ta-Jen; Cho, NamJu; Hsieh, Ming-Che

doi:10.1109/ectc.2019.00050

Cited by 6 publications

(3 citation statements)

References 7 publications

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“…Furthermore, ACF bonding is not repairable. By contrast, laser-assisted bonding (LAB) [150] has the advantages for selective bonding, localized heating and very fast temperature control, making it suitable for fine-pitch Mini/ Micro-LED bonding. [54,151] Joo et al [54] developed a LAB process to integrate Micro-LEDs onto the driver board, which is schematically shown in Figure 15a.…”

Section: Laser-assisted Bonding (Lab)mentioning

confidence: 99%

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Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to its high brightness, fast switching speed, and low power consumption. The commercialization of this technique is being explored by developing advanced processing techniques on an industrial scale. Recent ground‐breaking advances in the manufacture of Micro‐LEDs are mainly based on powerful laser micro/nano‐processing techniques with the unique ability to fabricate materials, structures and devices with the advantages of non‐contacting processing, high efficiency, adjustable coverage from micro‐ to macroscale and the compatibility with organic and inorganic materials. This paper categorizes, reviews and analyzes the main challenges and technical solutions in the Micro‐LED displays by various laser manufacturing processes, covering chip dicing, geometry shaping, laser annealing, laser lift‐off (LLO), laser‐based Micro‐LED transfer, laser‐assist bonding (LAB) and laser repair. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress in the field. Finally, a detailed analysis of the advantages and disadvantages of these techniques is given, and the future research directions of laser techniques in Micro‐LED display are discussed.

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Section: Laser-assisted Bonding (Lab)mentioning

confidence: 99%

“…Furthermore, ACF bonding is not repairable. By contrast, laser‐assisted bonding (LAB) [ 150 ] has the advantages for selective bonding, localized heating and very fast temperature control, making it suitable for fine‐pitch Mini/Micro‐LED bonding. [ 54,151 ]…”

Section: Laser Processing Techniques For Micro‐ledsmentioning

confidence: 99%

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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“…On the other hand, the requirements of cybersecurity are inconsistent with what we seek, as advanced security measures such as sophisticated encryption or intrusion detection systems (IDS) require high computing capabilities which require increasing the transistor count, which in turn increases the cost, size, and power consumption. Even adopting smaller silicon geometries (e.g., 7nm chips) that could help in terms of size and power has a more expensive up-front cost and, therefore, require higher sales volumes to be profitable and cost-effective [73].…”

Section: A Security Objectivesmentioning

confidence: 99%

Analytical Review of Cybersecurity for Embedded Systems

Aloseel

Shaw

et al. 2021

IEEE Access

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To identify the key factors and create the landscape of cybersecurity for embedded systems (CSES), an analytical review of the existing research on CSES has been conducted. The common properties of embedded systems, such as mobility, small size, low cost, independence, and limited power consumption when compared to traditional computer systems, have caused many challenges in CSES. The conflict between cybersecurity requirements and the computing capabilities of embedded systems makes it critical to implement sophisticated security countermeasures against cyber-attacks in an embedded system with limited resources, without draining those resources. In this study, twelve factors influencing CSES have been identified: ( 1) the components; (2) the characteristics; (3) the implementation; (4) the technical domain; (5) the security requirements; (6) the security problems; (7) the connectivity protocols; (8) the attack surfaces; (9) the impact of the cyber-attacks; (10) the security challenges of the ESs; (11) the security solutions; and(12) the players (manufacturers, legislators, operators, and users). A Multiple Layers Feedback Framework of Embedded System Cybersecurity (MuLFESC) with nine layers of protection is proposed, with new metrics of risk assessment. This will enable cybersecurity practitioners to conduct an assessment of their systems with regard to twelve identified cybersecurity aspects. In MuLFESC, the feedback from the systemcomponents layer to the system-operations layer could help implement "Security by Design" in the design stage at the bottom layer. The study provides a clear landscape of CSES and, therefore, could help to find better comprehensive solutions for CSES.INDEX TERMS Characteristics of embedded system, countermeasures, embedded system, cybersecurity of embedded system, MuLFESC, risk assessment.

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Advanced Flip Chip Packaging

Leong¹,

Huang²

2023

Springer Series in Reliability Engineering

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7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package with Laser Assisted Bonding and Mass Reflow Technology

Cited by 6 publications

References 7 publications

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Analytical Review of Cybersecurity for Embedded Systems

Advanced Flip Chip Packaging

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