2014
DOI: 10.1109/tcpmt.2013.2292931
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77-GHz Automotive Radar Sensor System With Antenna Integrated Package

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Cited by 23 publications
(3 citation statements)
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“…封装天线技术继承和发扬了微带 天线、多芯片电路模块及瓦片式相控阵天线结构的集成概念, 将天线触角伸向集成电路、封装与新型 材料等领域 [11] . 相比于 AoC, AiP 将多种器件与电路集成在一个封装内, 完成片上天线难以实现的 复杂功能和特定的系统级封装, 有效避免了半导体衬底的低电阻率带来的增益损耗问题, 天线辐射效 率一般达到 80%以上 [12,13] . 封装形式有芯片直接贴装 (direct chip attach, DCA) [14] 、焊盘阵列封装 (land grid array, LGA) [15] 、四侧无引线扁平封装 (quad flat no lead, QFN) [16,17] 、嵌入式晶圆级球栅 阵列 (embedded wafer level ball grid array, eWLB) 封装 [18] , 以及基于低温共烧陶瓷 (low temperature co-fired ceramics, LTCC) 封装 [19] .…”
Section: 有源阵列天线与天线阵列微系统unclassified
“…封装天线技术继承和发扬了微带 天线、多芯片电路模块及瓦片式相控阵天线结构的集成概念, 将天线触角伸向集成电路、封装与新型 材料等领域 [11] . 相比于 AoC, AiP 将多种器件与电路集成在一个封装内, 完成片上天线难以实现的 复杂功能和特定的系统级封装, 有效避免了半导体衬底的低电阻率带来的增益损耗问题, 天线辐射效 率一般达到 80%以上 [12,13] . 封装形式有芯片直接贴装 (direct chip attach, DCA) [14] 、焊盘阵列封装 (land grid array, LGA) [15] 、四侧无引线扁平封装 (quad flat no lead, QFN) [16,17] 、嵌入式晶圆级球栅 阵列 (embedded wafer level ball grid array, eWLB) 封装 [18] , 以及基于低温共烧陶瓷 (low temperature co-fired ceramics, LTCC) 封装 [19] .…”
Section: 有源阵列天线与天线阵列微系统unclassified
“…Different fan‐out (FO) antennas and antenna arrays are presented in the literature at 28, 4–6 60, 7–13 77, 14–18 and above 100 GHz 19 . Most of these designs use either double molding layers, multiple re‐distribution layers (RDL), metallization on top mold, through mold VIAs, or airgap in the mold.…”
Section: Introductionmentioning
confidence: 99%
“…Seventy seven‐gigahertz automotive radar systems have emerged as a key technology that improves driving safety . The total cost of an automotive radar system should be attractive to end customers for it to be successful in the market.…”
Section: Introductionmentioning
confidence: 99%