500-Gbps Parallel-WDM Optical Interconnect

Lemoff, B. E.; Ali, Muhammad Hassaan; Panotopoulos, George; Groot, E. de; Flower, G.M.; Rankin, G.; Schmit, A.J.; Djordjev, K.; Tan, Michael; Tandon, Ashish; Gong, W.; Telia, R.P.; Law, B.; Dolfi, David W.

doi:10.1109/ectc.2005.1441397

Cited by 21 publications

(4 citation statements)

References 6 publications

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“…The size of WDM multiplexers reported so far is in the range of several mm. 11,14) The device length is as small as 200 m. This would be the smallest configuration ever reported to our knowledge. The proposed hollow waveguide multiplexer would be useful for realizing compact WDM transceivers for high-capacity optical interconnects.…”

mentioning

confidence: 90%

“…There have been some reports on VCSEL-based WDM modules including a hybrid integration approach of discrete VCSELs and either a polymer waveguide multiplexer 10) or a dielectric film multiplexer. 11) In order to realize WDM transceivers based on multi-wavelength VCSEL arrays, however, a low-cost and compact multiplexer is needed for combining each VCSEL output in a multi-mode fiber. Small footprint of multiplexers should be an important issue for optical interconnect applications.…”

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confidence: 99%

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Multiplexing of Multi-Wavelength 1060-nm-Band GaInAs/GaAs Vertical Cavity Surface Emitting Laser Array Using Tapered Hollow Waveguide

Imamura¹,

Matsutani²,

Koyama³

2011

Appl. Phys. Express

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We present the ultra-compact hybrid integration of a 1060-nm-band multi-wavelength vertical cavity surface emitting laser (VCSEL) array with a tapered hollow waveguide multiplexer. The design of the hollow waveguide multiplexer is presented based on ray optics. We show the potential of a 12-channel array VCSEL output multiplexed in a multi-mode fiber. The device length is as small as 200 µm. The proposed hollow waveguide multiplexer would be useful for realizing compact wavelength division multiplexing (WDM) transceivers for optical interconnects.

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mentioning

confidence: 90%

mentioning

confidence: 99%

Multiplexing of Multi-Wavelength 1060-nm-Band GaInAs/GaAs Vertical Cavity Surface Emitting Laser Array Using Tapered Hollow Waveguide

Imamura¹,

Matsutani²,

Koyama³

2011

Appl. Phys. Express

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“…The modules reported always use VCSELs and multifiber MTP(R) connectors as optical interfaces. Among the advanced works studied in the past year, one should already mention the MAUI project, whose demonstrators combine CWDM and Parallel optics technologies to get 500 Gbp/s aggregated bandwidth using 4 multiplexed wavelengths per channel [8].…”

Section: Introductionmentioning

confidence: 99%

Merging parallel optics packaging and surface mount technologies

et al. 2008

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Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

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“…The use of multiple (parallel) fibers will bring the aggregate OI capacity to the 1 Tbps level. A further increase to the 10 Tbps level is enabled by more aggressive use of spatial division multiplexing (SDM) or wavelength division multiplexing (WDM): multiple fibers with multiple cores and a single wavelength [10] or multiple fibers with a single core and multiple wavelengths [11]. Combining these techniques (multiple fibers with multiple cores and multiple wavelengths) will finally bring the aggregate OI capacity to the 100 Tbps level.…”

Section: Introductionmentioning

confidence: 99%

High-speed VCSELs and VCSEL arrays for single- and multi-core fiber interconnects

et al. 2015

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Our recent work on high speed 850 nm VCSELs and VCSEL arrays is reviewed. With a modulation bandwidth approaching 30 GHz, our VCSELs have enabled transmitters and links operating at data rates in excess of 70 Gbps (at IBM) and transmission over onboard polymer waveguides at 40 Gbps (at University of Cambridge). VCSELs with an integrated mode filter for single mode emission have enabled transmission at 25 Gbps over > 1 km of multimode fiber and a speed-distance product of 40 Gbps•km. Dense VCSEL arrays for multicore fiber interconnects have demonstrated 240 Gbps aggregate capacity with excellent uniformity and low crosstalk between the 40 Gbps channels.

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500-Gbps Parallel-WDM Optical Interconnect

Cited by 21 publications

References 6 publications

Multiplexing of Multi-Wavelength 1060-nm-Band GaInAs/GaAs Vertical Cavity Surface Emitting Laser Array Using Tapered Hollow Waveguide

Multiplexing of Multi-Wavelength 1060-nm-Band GaInAs/GaAs Vertical Cavity Surface Emitting Laser Array Using Tapered Hollow Waveguide

Merging parallel optics packaging and surface mount technologies

High-speed VCSELs and VCSEL arrays for single- and multi-core fiber interconnects

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