2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654406
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“3rd Level” Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use

R. Dudek
1
,
M. Hildebrandt
2
,
K. Kreysig
3
et al.
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Cited by 5 publications
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Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions

Meier
1
,
Leslie
2
,
Storz
3
et al. 2019
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
3
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Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions

Meier
1
,
Leslie
2
,
Storz
3
et al. 2019
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
3
0
0
0
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Impact of PCB-housing-interaction on QFN solder joint reliability

Vandevelde
1
,
Labie
2
,
Vanderstraeten
3
et al. 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
4
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Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing

Gleichauf
1
,
Maniar
2
,
Kuczynska
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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