3D thermal-aware floorplanner using a MOEA approximation

Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization

“…As compared with previous approaches, the work presented here achieves a practical and effective solution in the field of interest, outperforming the results obtained by these works. This paper also extends our previous work presented in [14] with the following major upgrades: • The proposal of a novel structure, called air isolation channels, as an effective mechanism for thermal isolation in 3D chips. • The development of the required thermal models for these structures that enable their control by the optimization algorithm.…”

“…MFA was first proposed by David Cuesta et al [14]. This algorithm performs an incremental floorplanning divided in two phases.…”

“…Most of these representations do not perform well in our scenario because they were initially developed to reduce area, whereas our problem is based on minimizing temperature. To this end, we extend in this paper our previous algorithm for floorplanning optimization named Multi-objective Floorplanning Algorithm (MFA) [14], in which we formulated a multi-objective optimization problem for 3D thermal aware floorplanning that is able to reduce peak temperature, eliminate hotspots, and hence decrease reliability risks related to temperature. MFA allows the incremental placement of FUs and TSVs.…”

“…From our previous work in [14], as Fig. 2 introduces, we have enhanced the TSVs placement developing the new MFA FU* that slightly extends MFA FU to obtain solutions where at least one TSV configuration can be reached.…”

“…• The development of the required thermal models for these structures that enable their control by the optimization algorithm. • The extension of the MFA algorithm presented in [14] with two new evolutionary algorithms, to consider the new design constraints and technologies, achieving better results in terms of thermal profile and fabrication costs.…”