3D Radiation Detectors: Charge Collection Characterisation and Applicability of Technology for Microdosimetry

Abstract

Abstract-A study of charge collection in SINTEF 3D active edge silicon detectors was carried out at ANSTO using Ion Beam Induced Charge (IBIC) technique. An IBIC study has shown that several different geometries of 3D detectors have full depletion under low applied bias. The effect of fast neutron and gamma radiation on their charge collection efficiency was also investigated. A 3D active edge silicon detector technology has demonstrated extremely promising performance for application of the 3D Sensitive Volumes (SVs) fabrication methods to SOI microdosimetry.

Microdosimetric measurements of a clinical proton beam with micrometer‐sized solid‐state detector

“…The MicroPlus probe is fabricated using silicon‐on‐insulator wafers with 10 μm thick silicon active volume. Each microdosimeter detector is fabricated using 3D‐mesa technology and has a silicon substrate of area 0.6 mm × 0.8 mm with a single, silicon 3D SV of rectangular‐parallel piped shape on top of silicon oxide. The p+ and n+ regions of the single 3D SV are electrically connected to contact pads using 1 μm thick Al connectors placed on top of a passive silicon bridge.…”

Thin Silicon Microdosimeter Utilizing 3-D MEMS Fabrication Technology: Charge Collection Study and Its Application in Mixed Radiation Fields

“…The CMRP in collaboration with SINTEF have applied patented technology and have fabricated fully 3D SV array microdosimeters (also called "mushroom" microdosimeters). The feasibility studies have been performed earlier with different types of 3D detectors for microdosimetry applications [11,12]. This paper presents two significant structures of 3D mushroom microdosimeters, their electrical and charge collection properties and preliminary results of dose equivalent obtained with these devices in a mixed radiation field.…”

Micromachined silicon radiation sensors - Part 1: Design and experimental characterization

“…Very thin sensors, that are attractive in high-energy and nuclear physics e.g., for timing or particle identification, or to improve the momentum resolution by reducing multiple scattering, can be obtained by locally thinning the silicon substrate by DRIE or chemical etching by TMAH or KOH [4]. Microstructured silicon sensors with high aspect-ratio cavities filled by proper converting materials (e.g., 6 LiF, 10 B) are emerging as viable alternatives to gas based sensors for the detection of thermal neutrons with high efficiency and low cost, as requested by several applications like homeland security, forensics, material science, to cite a few [5]. Very small detection volumes can be accurately defined by a combination of DRIE and wet etching, as requested for microdosimetry in synchrotron and particle therapy and space radiation protection [6].…”

“…Microstructured silicon sensors with high aspect-ratio cavities filled by proper converting materials (e.g., 6 LiF, 10 B) are emerging as viable alternatives to gas based sensors for the detection of thermal neutrons with high efficiency and low cost, as requested by several applications like homeland security, forensics, material science, to cite a few [5]. Very small detection volumes can be accurately defined by a combination of DRIE and wet etching, as requested for microdosimetry in synchrotron and particle therapy and space radiation protection [6]. Other interesting options, not dealing to the very sensor but rather to related system issues, are micro-channels for cooling [7], and feedthrough connections similar to TSVs but much deeper [8].…”