3D printing of ceramics and graphene circuits-on-ceramics by thermal bubble inkjet technology and high temperature sintering

Huang, Zheguan; Tang, Yang; Guo, Hao; Feng, Xiaoyuan; Zhang, Tingting; Li, Peng; Qian, Bo; Xie, Yusheng

doi:10.1016/j.ceramint.2019.12.278

Cited by 32 publications

(19 citation statements)

References 24 publications

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“…[243][244][245][246][247][248] Inkjet printing technologies include two main types: thermal and piezoelectric prints. [244,[249][250][251][252][253][254] For thermal print, a thin film resistor in the thermal print head is used to heat the ink to form a vapor bubble, forcing the droplets out of the nozzle. [249][250][251] In piezoelectric print, a piezoelectric actuator is used to apply controlled pressure to the ink in the nozzle for continuous, on-demand printing.…”

Section: Inkjet Printingmentioning

confidence: 99%

“…[244,[249][250][251][252][253][254] For thermal print, a thin film resistor in the thermal print head is used to heat the ink to form a vapor bubble, forcing the droplets out of the nozzle. [249][250][251] In piezoelectric print, a piezoelectric actuator is used to apply controlled pressure to the ink in the nozzle for continuous, on-demand printing. [252][253][254] A typical piezoelectric inkjet printing process is as follows: the ink materials are firstly prepared and dispersed in the ink chamber; subsequently, the electrically-driven piezoelectric actuator will drive the dispensing of ink droplets with controlled volume out of the printhead nozzle, when the transmitted energy from the actuator exceeds the surface energy for the droplet formation.…”

Section: Inkjet Printingmentioning

confidence: 99%

“…[247,248,255] As an efficient, stable, and economical manufacturing technology, inkjet printing can rapidly prototype miniaturized components for wearable and flexible electronics devices. [249,250,252,253] The printhead and ink formulation are the critical factors for pushing the printing resolution. [244,255,256] Inkjet printing has been used for printing a broad range of device applications such as light-emitting diodes, conductive structures, sensors, solar cells, thin-film transistors, memory devices and biological/pharmaceutical fields (e.g., inkjet-printed immunological drug screening kit) etc.…”

Section: Inkjet Printingmentioning

confidence: 99%

“…[265,[266][267][268][269][270][271] The common materials that can be 3D-printed include metals/ alloys, [272][273][274][275] (e.g., aluminum (Al) alloys, stainless, titanium, and its alloys), polymers and composites, [276][277][278][279] (e.g., polycarbonate (PC) and polylactic acid (PLA)), ceramics and biomaterials, (e.g., cellulose, silk, chitosan) etc. [61,174,249,[280][281][282][283] However, the fatigue strength of 3D printed objects is usually unsatisfactory due to the porosity and surface roughness of the printed structures, which necessitates the complex and expensive postmanufacturing treatments, e.g., hot isostatic pressing (HIP) and heat treatments, for improving the mechanical strength of 3D printed objects. [249,255,284,285] Moreover, the soft mechanical nature of polymers and biomaterials limits their printability in 3D structures.…”

Section: D Printingmentioning

confidence: 99%

“…[61,174,249,[280][281][282][283] However, the fatigue strength of 3D printed objects is usually unsatisfactory due to the porosity and surface roughness of the printed structures, which necessitates the complex and expensive postmanufacturing treatments, e.g., hot isostatic pressing (HIP) and heat treatments, for improving the mechanical strength of 3D printed objects. [249,255,284,285] Moreover, the soft mechanical nature of polymers and biomaterials limits their printability in 3D structures. [61,255,283,286,287] Recent research shows that fiber reinforcement is an effective approach for improving the mechanical properties of the polymers and biomaterials in 3D printing.…”

Section: D Printingmentioning

confidence: 99%

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Bio‐Derived Natural Materials Based Triboelectric Devices for Self‐Powered Ubiquitous Wearable and Implantable Intelligent Devices

Yang

Fan

2020

Advanced Sustainable Systems

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The capability of devices in future ubiquitous networked wearable and implantable electronics to efficiently scavenge and store operational power from their working environment through sustainable pathways would enable viable self‐powering schemes in societally‐pervasive applications such as advanced healthcare and robotics. Triboelectric nanogenerators (TENGs) can efficiently harvest the ubiquitous mechanical energy for powering electronics and sensors. However, the majority of demonstrated TENG prototypes have been built with materials that are not biodegradable or biocompatible, which significantly hinders the application of TENGs for wearable and implantable technologies. In this review, the recent progress of the wearable and implantable triboelectric devices built with bio‐derived natural materials is summarized. The properties of these natural biopolymers are discussed in the context of self‐powered triboelectric applications. The common manufacturing methods for processing these materials into triboelectric devices are also discussed. In addition, the applications of the bio‐derived natural materials based TENGs for in vitro and in vivo applications are discussed. Finally, the outstanding challenges and potential opportunities for the development of bio‐derived natural materials based triboelectric devices targeting wearable and implantable human‐integrated applications are analyzed.

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Section: Inkjet Printingmentioning

confidence: 99%

Section: Inkjet Printingmentioning

confidence: 99%

Section: Inkjet Printingmentioning

confidence: 99%

Section: D Printingmentioning

confidence: 99%

Section: D Printingmentioning

confidence: 99%

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Bio‐Derived Natural Materials Based Triboelectric Devices for Self‐Powered Ubiquitous Wearable and Implantable Intelligent Devices

Yang

Fan

2020

Advanced Sustainable Systems

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A Low‐Binder‐Content Ink System for 3D Printing High‐Density and Small Feature Size 316L Stainless Steel Parts

Guo,

Qin,

Zhou

et al. 2023

Adv Eng Mater

Self Cite

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Binder ink system is the backbone of binder jet 3D printing (BJ‐3DP) technology. Comparing with metal injection molding (MIM), BJ‐3DP needs much less amount of binder, which means less exhaust gas generation during the debinding process and more environmental‐friendly. More than that, low content of binder is also supposed to benefit to the structure properties of the printed metal parts. In this paper, an ultralow‐binder‐content ethanol‐water‐PVP ink system was demonstrated for the BJ‐3DP 316L stainless steel parts by applying thermal bubble inkjet technology. The PVP binder concentration is as low as 80 mg/ml, which can achieve an ultralow solid content of 0.2 wt% in the printed green part. The two‐component solution with water and ethanol provides not only the rheology property adjustment freedom for the ink jetting and infiltration in the metal powders, but also the two boiling points for the step‐by‐step capillary bridge formation process. By applying the low‐binder‐content ink, the fully densified 316L stainless steel parts after sintering can obtain the relative density up to 99.4%, Vickers hardness up to 185 HV, tensile strength up to 542 MPa, 25% elongation at break, and feature size as small as 200 μm.This article is protected by copyright. All rights reserved.

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Advances in Printing and Electronics: From Engagement to Commitment

Martins

Pereira

Lima

et al. 2023

Adv Funct Materials

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In recent years, printed electronics reached enormous popularity as a result of their huge potential to offer unique features that are not attainable through traditional fabrication, namely low‐cost production, multifunctionality, stretchability, sustainability, and flexibility. Being expected a galloping increase in the use of printed technologies in the near future, due to the digitalization efforts associated with the Internet of Things and the 4.0 revolution, it is timely and desirable to discuss the joint features, the interrelations, the complementarities, the interdependency, and the most demanding challenges linked to the relation between printed technologies and electronic materials. In this context, this study offers a broad review of the numerous printing technologies used in the processing of electronics, commonly used substrates, the most effective printed electronic materials, and the key post‐printing treatments such as sintering. Disruptive challenges in various printing techniques, (un)expected future research directions of printed electronics, and imminent application trends are also highlighted, following a critical and subjective perspective.

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3D printing of ceramics and graphene circuits-on-ceramics by thermal bubble inkjet technology and high temperature sintering

Cited by 32 publications

References 24 publications

Bio‐Derived Natural Materials Based Triboelectric Devices for Self‐Powered Ubiquitous Wearable and Implantable Intelligent Devices

Bio‐Derived Natural Materials Based Triboelectric Devices for Self‐Powered Ubiquitous Wearable and Implantable Intelligent Devices

A Low‐Binder‐Content Ink System for 3D Printing High‐Density and Small Feature Size 316L Stainless Steel Parts

Advances in Printing and Electronics: From Engagement to Commitment

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