2019
DOI: 10.1016/j.jmapro.2018.11.001
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3D printing fabrication of porous bismuth antimony telluride and study of the thermoelectric properties

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Cited by 40 publications
(36 citation statements)
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“…Minimum resistivity is observed for the maximum BST loading . Absolute resistivity values are comparable to those reported for other BST/polymer blends [ 13 , 14 , 28 , 29 , 34 , 35 ]. Unfortunately, BST/ABS foils with higher ratios cannot be acquired, since the produced foils are extremely fragile due to the very low ABS concentration.…”
Section: Resultssupporting
confidence: 84%
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“…Minimum resistivity is observed for the maximum BST loading . Absolute resistivity values are comparable to those reported for other BST/polymer blends [ 13 , 14 , 28 , 29 , 34 , 35 ]. Unfortunately, BST/ABS foils with higher ratios cannot be acquired, since the produced foils are extremely fragile due to the very low ABS concentration.…”
Section: Resultssupporting
confidence: 84%
“…Notably, the charge carrier conduction is severely affected by the presence of grain boundaries resulting in enhanced resistivity, as well as an increased Seebeck coefficient, with decreasing grain size [ 36 , 37 ]. Moreover, porosity also enhances the Seebeck coefficient [ 35 ], in contrast to the observed slightly reduced values. Further investigation is required to clarify such a contradiction; however, it is beyond the scope of the current study.…”
Section: Resultsmentioning
confidence: 99%
“…Bi 0.5 Sb 1.5 Te 3 ‐based porous TE samples were fabricated by SLS. The introduction of porous structure enabled the reduction of thermal conductivity while keeping the electronic conductivity at a relatively high level (Figure 7B), leading to the ZT improvement in comparison with bulk TE sample 144 . Kim et al 145 .…”
Section: Printed Advanced Functional Polymeric Devicesmentioning
confidence: 99%
“…However, it is difficult to obtain complex shapes through conventional methods such as hot pressing, spark plasma sintering, and zone melting. 140 So far, SLA, 141 FDM, 142,143 SLS, 144 DIW, [145][146][147][148] SLM, [149][150][151][152] 3D printing technologies have been investigated for the preparation of TE devices.…”
mentioning
confidence: 99%
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