3D porous metal structure manufacturing using UV pulsed laser and copper formate solution

Copper inks for printed electronics: a review

“…236 Copper precursor inks exhibit high absorption peaks below 400 nm and are often sintered by UV. 242 UV sintering can yield conductive patterns in a relatively short time, but the high-energy irradiation may make the decomposition process violent and produce large amounts of gas, resulting in uneven copper nucleation, excessive pores, and other factors. Although the absorption band of copper nanomaterials in the infrared region is small, infrared light has a strong thermal effect, which can quickly increase the temperature of the printed ink to achieve the decomposition of organics and thermal fusion of copper particles.…”

Fabrication methods and property analysis of metal foams – a technical overview

“…The mechanical properties of fabricated foam were better as compared to existing literature. Kang et al [41] Copper formate Solution, UV pulse laser.…”

Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication

“…In addition, some metals, such as copper, can be oxidized easily, resulting in a short shelf life and difficulty in mass production. To overcome these problems, metal-organic decomposition (MOD) ink has been studied as an alternative to NP ink [19][20][21][22][23][24][25][26][27][28]. Unlike NP ink, which comprises metals as particles, MOD ink comprises metals in their ionic state.…”

“…In addition, it is suitable for the fabrication of nanopatterned surfaces. In direct laser writing (DLW) [26][27][28][29][30][31][32][33][34][35][36], lasers provide sufficient heat required for the chemical reaction of the ink. Although a few researchers have reported DLW using MOD ink [6,29], the resolution limit of typical metal DLW reaches only a few micrometers.…”