3D-ICE 3.0: Efficient Nonlinear MPSoC Thermal Simulation With Pluggable Heat Sink Models

Abstract

The increasing power density in modern highperformance multi-processor system-on-chip (MPSoC) is fueling a revolution in thermal management. On the one hand, thermal phenomena are becoming a critical concern, making accurate and efficient simulation a necessity. On the other hand, a variety of physically heterogeneous solutions are coming into play: liquid, evaporative, thermoelectric cooling, and more. A new generation of simulators, with unprecedented flexibility, is thus required. In this paper, we present 3D-ICE 3.0, the first thermal simulator to allow for accurate nonlinear descriptions of complex and physically heterogeneous heat dissipation systems, while preserving the efficiency of latest compact modeling frameworks at the silicon die level. 3D-ICE 3.0 allows designers to extend the thermal simulator with new heat sink models while simplifying the time-consuming step of model validation. Support for nonlinear dynamic models is included, for instance to accurately represent variable coolant flows. Our results present validated models of a commercial water heat sink and an air heat sink plus fan that achieve an average error below 1 • C and simulate, respectively, up to 3x and 12x faster than the real physical phenomena.

Monolithic 3D integration of 2D transistors and vertical RRAMs in 1T–4R structure for high-density memory

“…Power dissipation in monolithic 3D systems could be more complicated than planar structures, and could potentially lead to issues in 3D integration. Therefore, we further simulate the thermal dissipation and temperature in the 1T– n R array using the 3D-ICE emulator 68 , and show that the temperature increase is tolerable for reasonably large parallel data transfer, as detailed in Supplementary Figs. 28 and 29 .…”

Dynamic performance analysis of aircraft chassis based on 3D simulation technology

“…3D simulation technology is a virtual system with multi-stage [7]. When modeling, you need to have a certain understanding of the whole model.…”

Reliability-oriented resource management for High-Performance Computing

“…First of all, the need to simulate a large number of cores and CPUs to model an HPC infrastructure poses stringent performance requirements on thermal simulations. Moreover, since for similar performance considerations the simulation of the cores is coarse grain, current HPC simulators, such as DCworms, do not provide enough micro-architectural statistics to be able to reconstruct the power dissipated in each functional unit of every core, in order to construct the fine-grain power information that is needed as input by existing thermal models [24].…”