3D FDTD analysis of a SOT353 package containing a bipolar wideband cascode transistor using the compression approach

Rittweger, M.; Werthen, M.; Kunisch, J.; Wolff, I.; Chall, P.; Balm, B.N.; Lok, P.

doi:10.1109/mwsym.1995.406279

Cited by 11 publications

(4 citation statements)

References 4 publications

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“…Figure 2. A measuring setup was built that is capable of determining the output mixer products over a relatively large frequency band (2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18). It is often said that the FDTD enhances the user's understanding of the essential physics underlying the various processes that it can model.…”

Section: Resultsmentioning

confidence: 99%

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Modeling of an X-band planar balanced mixer with a mixed spice-FDTD program

Bégassat

Ramboz

Wong

et al. 1996

Microw. Opt. Technol. Lett.

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The conclentional FDTD method is combined with the SPICE program to analyze an X-band planar balanced mixer. The aduantages of the Campus Universitario s / n 36200 Vigo Spain KEY TERMS Fiber r~~. s o n a~~r s . ~ionlineu~ oprics, optical oscillators. optical signal prow~sing ABSTRACT I n r1ii.s Lerter u'e srirdy /tie rransienr hehai,ior. of a notilinear iwo-coupler fiber-ring resorio~or operaring as im optical oscillaior. The shape of die pi1w.s genrratetl atid the speed in [lie e.sruhlishtneni of osci1lririori.s are itrr~esri~~~ted. ' ? 1096 John Wilev & Sons, Inc.

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Section: Resultsmentioning

confidence: 99%

“…the FDTD method provides a broad view of the whole system. It can incorporate passive or active, linear o r nonlinear lumped elements by interfacing directly with the SPICE device modeling software [ 3 ] or by using a compression approach [4].…”

Section: Discussionmentioning

confidence: 99%

Modeling of an X-band planar balanced mixer with a mixed spice-FDTD program

Bégassat

Ramboz

Wong

et al. 1996

Microw. Opt. Technol. Lett.

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“…For example, output to input isolation is vital for amplitiers or filters to prevent unwanted feedback or filter stopband deterioration, respectively. The fidl-wave calculation of a simpler package is described in [4], and some slightly more complex arrangements are investigated with approximate techniques in [5]. The latter methods use lumped element approaches and do not consider electromagnetic effects exactly enough.…”

Section: Ini'koductionmentioning

confidence: 99%

“…An alternative approach is the usage of discrete ports or inner pom [4]. Such ports no longer require the existence of physical transmission lines as they are defined between two nodes.…”

Section: B Segrrientation Within Full-wave Simularionsmentioning

confidence: 99%

Full-wave characterization of RF ceramic packages

Schuh¹,

Bilzer

Menzel

et al.

33rd European Microwave Conference Proceedings (IEEE Cat. No.03EX723C)

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The characterization of small complex CP ramic packages with (monolithically) integrated microwave circuits is investigated using full-wave methods In order to correctly design packaged radio frequency (RF) chips, the consideration of the package has become an indispendible part of the chip design process, as the electrical properties of the package have a great impact on the performance of the KF chips For an effectise simulation, a segmentation hetween the chip and i& immediate environment, such as, the package, is investigated, and a suitable interface hetween chip and package is proposed to prove the validity of the interface, the simulation of the packaged RF device, which is pieced together from the full-nave simulation of the package and the simulation of the RF chip, i s compared to the corresponding measurement Simulation and measurement of the packaged RF device w e e very well.

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