3 kV 600 A 4H-SiC high temperature diode module

Sugawara, Y.; Takayama, Daisuke; Asano, Kōichi; Singh, Ranbir; Kodama, Hironori; Ogata, S.; Hayashi, Toshihiko

doi:10.1109/ispsd.2002.1016217

Cited by 12 publications

(10 citation statements)

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“…Careful selection of materials in the module is also important to avoid CTE mismatch. CTE mismatch can lead to die fracture, fatigue and lifting, horizontal crack propagation, delamination and cracking of the ceramic substrate [57,198,199].…”

Section: Substratementioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

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With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

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Section: Substratementioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

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“…When the current slope becomes greater, oscillated recovery current becomes larger. The simulated and experimental recovery waveforms of a developed press packed 3 kV-600A SiC pin diode module are shown in Figure 3 (e) [2]. Simulated results are obtained by using the above-mentioned modeling method.…”

Section: Forward Characteristicsmentioning

confidence: 99%

“…Some high voltage and high current capability SiC pin diodes have been developed [1,2] and their practical applications are under considerations. In order to use the diodes in inverter circuits, the numerical simulation is inevitable to design the circuits and determine the passive elements values.…”

Section: Introductionmentioning

confidence: 99%

Simple circuit model of SiC pin diode composed by using experimental electrical characteristics

Asano

Funaki

Sugawara

et al. 2005

IEICE Electron. Express

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Abstract:In this paper, new simple circuit models for developed SiC pin diodes are proposed. They are based on the electrical characteristics obtained in experiments without any detail information of internal structure and physical parameters. The validity of the circuit models is confirmed by correspondence between simulated characteristics and experimental one. The model installed in the experimental circuit configuration can precisely simulate the waveforms of the reverse recovery current and the forward characteristics. As a result, the proposed model is shown to be appropriate for describing the characteristics of high capability SiC diode module in the circuit operation.

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“…On the other hand, the lack of dielectric insulation in the module and a more complex assembly system are the major trade-offs [1]. Press-pack modules are currently commercially available for silicon devices but only few studies have been done for silicon carbide devices [3], [4]. The limitations of the traditional packaging systems for SiC technology [5] and the availability of larger area silicon carbide dies, which may reduce the mechanical complexity of the press-pack module design, suggest that the study of the properties, performance and benefits of silicon carbide press-pack power modules is timely and appropriate.…”

Section: Introductionmentioning

confidence: 99%