3-Dimensional Numerical Simulation of Open-Barrel Crimping Process

Zhmurkin, D. V.; Copper, Charles; Hilty, Robert D.

doi:10.1109/holm.2008.ecp.41

Cited by 16 publications

(10 citation statements)

References 6 publications

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“…Furthermore, a study by Zhmurkin et. al [4] using 3-D dynamic simulations of the crimping process predicted the existence of spring back to the extent that separation would occur between the terminal body and the conductors and between the conductors even when full compression of the conductors was achieved in the crimping process. The model thus indicated there would be little or no residual force to maintain the crimp interface.…”

Section: Crimp Design Review a Brief Overview Of Crimp Theorymentioning

confidence: 98%

“…As the terminal is released from the crimp tooling, the elastic strain causes spring back in these components. If the crimp barrel has a greater degree of spring back than the conductor, in the absence of some mechanism (e.g., cold welds) to maintain contact between the conductor and crimp barrel, physical contact maybe reduced [3,4]. If spring back of a sufficient degree to cause lack of the electrical interface were to occur, failure of the termination could be noted when it was first used.…”

Section: Spring Backmentioning

confidence: 99%

See 1 more Smart Citation

Forensic analysis of thermally stressed crimp connections

Williams

Range

Pascucci

et al. 2015

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)

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Occasionally thermally stressed connectors have come back from the field with initial investigations confirming the crimp height was slightly above the upper design specification limit. Experimental designs were then conceived and conducted independently at both TE Connectivity and Whirlpool Corporation to investigate if the out-of-specification crimp heights were a result of the overheating in the area or potentially the cause of overheating in the area. The results were compared to the known mechanisms for joint degradation including stress relaxation, and cold welding breakdown including spring back analysis. The experimental investigation, coupled with comparison to current crimp models, helps further forensic investigations and the specific understanding of material behavior in crimped connectors.

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Section: Crimp Design Review a Brief Overview Of Crimp Theorymentioning

confidence: 98%

Section: Spring Backmentioning

confidence: 99%

Forensic analysis of thermally stressed crimp connections

Williams

Range

Pascucci

et al. 2015

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)

View full text Add to dashboard Cite

show abstract

“…A study on the reliability of crimp connections was published in 1978 containing a mathematical model and the factors which affect the reliability of crimp connections [ 60 ] Optimization of the tool design, determination of parameters, effect of friction and comparison of implicit and explicit finite element methods to model crimp connections have been further investigated by different scholars [ 61 , 62 ]. Simon et al [ 63 ] worked on the development of a multi-terminal crimp package for smart textile integration based on Crimp Flat Pack (CFP) which is a lead-frame-based electronic package that features crimp terminals for integrating electronics into textiles.…”

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

“…A study on the reliability of crimp connections was published in 1978 containing a mathematical model and the factors which affect the reliability of crimp connections [54] Optimization of the tool design, determination of parameters, effect of friction and comparison of implicit and explicit finite element methods to model crimp connections have been further investigated by different scholars [55,56]. Simon et al, [57] worked on the development of a multi-terminal crimp package for smart textile integration based on Crimp Flat Pack (CFP) which is a lead-frame-based electronic package that features crimp terminals for integrating electronics into textiles.…”

Section: Mechanical Connectorsmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

View full text Add to dashboard Cite

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

3-Dimensional Numerical Simulation of Open-Barrel Crimping Process

Cited by 16 publications

References 6 publications

Forensic analysis of thermally stressed crimp connections

Forensic analysis of thermally stressed crimp connections

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-textile

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